Munich
Germany
10
2025-06-26
The entities that hold a legal rights for patent applications filed by inventor Prasad Vishnu:
Vishnu Prasad from Munich, DE has applied for patents for these inventions. The list has both pending applications and granted patents:
Active Cooling for Heterogenous Packages
#2 | 2025-06-26STIFFENER ASSEMBLY
#3 | 2025-06-19SUPPORT STRUCTURES FOR SEMICONDUCTOR SUBSTRATES
#4 | 2025-06-19ASSEMBLY AND METHOD FOR PREVENTING WARPAGE IN A SEMICONDUCTOR PACKAGE
#5 | 2024-11-28HEAT DISSIPATION SOLUTIONS FOR INTEGRATED CIRCUIT PACKAGES
#6 | 2023-10-05INTEGRATED CIRCUIT PACKAGES HAVING REDUCED Z-HEIGHT AND HEAT PATH
#7 | 2023-09-21INTEGRATED CIRCUIT PACKAGES HAVING REDUCED Z-HEIGHT
#8 | 2023-09-21MICROELECTRONIC ASSEMBLIES INCLUDING NANOWIRE AND SOLDER INTERCONNECTS
#9 | 2023-09-07STACKED DIE PACKAGING ARCHITECTURE WITH CONDUCTIVE VIAS ON INTERPOSER
#10 | 2019-12-26Thermal contacts at periphery of integrated circuit packages
3061525 ⎘