LUCAS, Texas
United States
13
2012-01-19
The entities that hold a legal rights for patent applications filed by inventor HARPER PETER R.:
PETER R. HARPER from LUCAS, US has applied for patents for these inventions. The list has both pending applications and granted patents:
Integrated circuit stacked package precursors and stacked packaged devices and systems therefrom
#2 | 2012-01-19BGA PACKAGE WITH TRACES FOR PLATING PADS UNDER THE CHIP
#3 | 2010-01-14INTEGRATED CIRCUIT PACKAGE WITH EMI SHIELD
#4 | 2009-12-24PACKAGED INTEGRATED CIRCUIT HAVING CONFORMAL ELECTROMAGNETIC SHIELDS AND METHODS TO FORM THE SAME
#5 | 2009-11-26Low Inductance Ball Grid Array Device Having Chip Bumps on Substrate Vias
#6 | 2009-08-20Integrated circuit stacked package precursors and stacked packaged devices and systems therefrom
#7 | 2009-07-02PACKAGED INTEGRATED CIRCUITS HAVING SURFACE MOUNT DEVICES AND METHODS TO FORM PACKAGED INTEGRATED CIRCUITS
#8 | 2009-05-07BGA package with traces for plating pads under the chip
#9 | 2009-03-05Semiconductor device having wafer level chip scale packaging substrate decoupling
#10 | 2009-02-05METHOD OF FORMING A STUD BUMP OVER PASSIVATION, AND RELATED DEVICE
#11 | 2008-10-23Simplified Substrates for Semiconductor Devices in Package-on-Package Products
#12 | 2007-02-08Packaged integrated circuit having a heat spreader and method therefor
#13 | 2005-06-09Inductive device including bond wires
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