Cheonan-si
South Korea
13
2012-01-19
The entities that hold a legal rights for patent applications filed by inventor SIN Wha-su:
Wha-su SIN from Cheonan-si, KR has applied for patents for these inventions. The list has both pending applications and granted patents:
PACKAGE-ON-PACKAGE SEMICONDUCTOR PACKAGE HAVING SPACERS DISPOSED BETWEEN TWO PACKAGE SUBSTRATES
#2 | 2011-05-26WAFER POLISHING APPARATUS FOR ADJUSTING HEIGHT OF WHEEL TIP
#3 | 2011-02-03WIRING SUBSTRATE FOR A SEMICONDUCTOR CHIP AND SEMICONDUCTOR PACKAGE HAVING THE WIRING SUBSTRATE
#4 | 2009-11-12Printed circuit board and method thereof and a solder ball land and method thereof
#5 | 2009-08-13METHOD OF MANUFACTURING A SEMICONDUCTOR PACKAGE
#6 | 2008-12-25Semiconductor package, semiconductor package module including the semiconductor package, and methods of fabricating the same
#7 | 2008-12-18Method of cutting a wafer
#8 | 2008-10-16Molding apparatus, molded semiconductor package using multi-layered film, fabricating and molding method for fabricating the same
#9 | 2007-03-15Method of fabricating wafer chips
#10 | 2007-03-08Semiconductor wafer level chip package and method of manufacturing the same
#11 | 2007-02-22Printed circuit board and method thereof and a solder ball land and method thereof
#12 | 2006-04-13Package stack and manufacturing method thereof
#13 | 2006-03-16Method of forming solder ball, and fabricating method and structure of semiconductor package using the same
3074768 ⎘