Ossining, New York
United States
185
2024-03-28
The entities that hold a legal rights for patent applications filed by inventor Divakaruni Ramachandra:
Ramachandra Divakaruni from Ossining, US has applied for patents for these inventions. The list has both pending applications and granted patents:
ACTIVE BRIDGE FOR CHIPLET AND MODULE INTER-COMMUNICATION
#2 | 2023-06-22MULTI-CHIP HIGH MEMORY BANDWIDTH CONFIGURATION
#3 | 2022-10-06NVM-BASED HIGH-CAPACITY NEURAL NETWORK INFERENCE ENGINE
#4 | 2021-01-21Multiple chip bridge connector
#5 | 2020-02-06Porous silicon relaxation medium for dislocation free CMOS devices
#6 | 2019-07-04Third type of metal gate stack for CMOS devices
#7 | 2019-06-20Fully depleted SOI device for reducing parasitic back gate capacitance
#8 | 2019-04-11Porous silicon relaxation medium for dislocation free CMOS devices
#9 | 2018-11-08FinFET with epitaxial source and drain regions and dielectric isolated channel region
#10 | 2018-11-08Multiple-bit electrical fuses
#11 | 2018-11-08Multiple-bit electrical fuses
#12 | 2018-09-20FinFET vertical flash memory
#13 | 2018-07-26Integrated strained stacked nanosheet FET
#14 | 2018-07-19Fully depleted SOI device for reducing parasitic back gate capacitance
#15 | 2018-06-21Vertical transistor including controlled gate length and a self-aligned junction
#16 | 2018-05-17Porous silicon relaxation medium for dislocation free CMOS devices
#17 | 2018-05-03Porous silicon relaxation medium for dislocation free CMOS devices
#18 | 2018-04-26Method for forming an extremely thin silicon-on-insulator (ETSOI) device having reduced parasitic capacitance and contact resistance due to wrap-around structure of source/drain regions
#19 | 2018-04-19Integrated strained stacked nanosheet FET
#20 | 2018-04-05Fully depleted SOI device for reducing parasitic back gate capacitance
#21 | 2017-11-09Vertical transistor including controlled gate length and a self-aligned junction
#22 | 2017-11-09Integrated strained stacked nanosheet FET
#23 | 2017-11-09Integrated strained stacked nanosheet FET
#24 | 2017-10-12Stacked nanowire devices
#25 | 2017-09-21Method for reduced parasitic capacitance and contact resistance in extremely thin silicon-on-insulator (ETSOI) devices due to wrap-around structure of source/drain regions
#26 | 2017-08-31Forming nanotips
#27 | 2017-08-15Integrated strained stacked nanosheet FET
#28 | 2017-08-15Reduced parasitic capacitance and contact resistance in extremely thin silicon-on-insulator (ETSOI) devices due to wrap-around structure of source/drain regions
#29 | 2017-08-10Stacked nanowire devices
#30 | 2017-08-10Third type of metal gate stack for CMOS devices
#31 | 2017-07-06Hybrid aspect ratio trapping
#32 | 2017-06-15Partially dielectric isolated fin-shaped field effect transistor (FinFET)
#33 | 2017-06-15FINFET CMOS with Si NFET and SiGe PFET
#34 | 2017-06-15FinFET CMOS with Si NFET and SiGe PFET
#35 | 2017-06-01FinFET with epitaxial source and drain regions and dielectric isolated channel region
#36 | 2017-04-04Self-aligned punchthrough stop doping in bulk finFET by reflowing doped oxide
#37 | 2017-04-04Vertical finfet with strained channel
#38 | 2017-03-16Porous silicon relaxation medium for dislocation free CMOS devices
#39 | 2017-03-16Porous silicon relaxation medium for dislocation free CMOS devices
#40 | 2017-02-09Semiconductor fin isolation by a well trapping fin portion
#41 | 2017-01-05Porous silicon relaxation medium for dislocation free CMOS devices
#42 | 2017-01-03Partially dielectric isolated fin-shaped field effect transistor (FinFET)
#43 | 2016-12-08LOCAL THINNING OF SEMICONDUCTOR FINS
#44 | 2016-11-01Stacked nanowire devices
#45 | 2016-11-01FinFET CMOS with Si NFET and SiGe PFET
#46 | 2016-10-06Hybrid aspect ratio trapping
#47 | 2016-09-27Y-FET with self-aligned punch-through-stop (PTS) doping
#48 | 2016-08-23Multiple threshold voltage FinFETs
#49 | 2016-07-28Finfet crosspoint flash memory
#50 | 2016-07-19Self-aligned punchthrough stop doping in bulk finFET by reflowing doped oxide
#51 | 2016-06-30Capacitor strap connection structure and fabrication method
#52 | 2016-06-16FinFET with epitaxial source and drain regions and dielectric isolated channel region
#53 | 2016-05-05FinFET vertical flash memory
#54 | 2016-01-12Embedded flash memory fabricated in standard CMOS process with self-aligned contact
#55 | 2015-12-31Trapping dislocations in high-mobility fins below isolation layer
#56 | 2015-12-17Semiconductor structure having buried conductive elements
#57 | 2015-12-10FinFET and fin-passive devices
#58 | 2015-11-26Structure and method for effective device width adjustment in finFET devices using gate workfunction shift
#59 | 2015-11-19Dielectric filler fins for planar topography in gate level
#60 | 2015-11-12FinFET and fin-passive devices
#61 | 2015-11-05FinFET with epitaxial source and drain regions and dielectric isolated channel region
#62 | 2015-09-03Third type of metal gate stack for CMOS devices
#63 | 2015-08-20Semiconductor structure having buried conductive elements
#64 | 2015-07-16Local thinning of semiconductor fins
#65 | 2015-06-11Finfet crosspoint flash memory
#66 | 2015-05-28SUBSTRATE LOCAL INTERCONNECT INTEGRATION WITH FINFETS
#67 | 2015-05-28Fin capacitor employing sidewall image transfer
#68 | 2015-01-29Fin field effect transistor with dielectric isolation and anchored stressor elements
#69 | 2015-01-29Dielectric filler fins for planar topography in gate level
#70 | 2015-01-22Process for faciltiating fin isolation schemes
#71 | 2015-01-22Intrinsic Channel Planar Field Effect Transistors Having Multiple Threshold Voltages
#72 | 2015-01-22Fin transformation process and isolation structures facilitating different Fin isolation schemes
#73 | 2015-01-22Semiconductor fin isolation by a well trapping fin portion
#74 | 2015-01-01Methods and structures for protecting one area while processing another area on a chip
#75 | 2014-12-25Strained finFET with an electrically isolated channel
#76 | 2014-09-11Semiconductor fin isolation by a well trapping fin portion
#77 | 2014-09-11Silicon-germanium fins and silicon fins on a bulk substrate
#78 | 2014-07-10Strained finFET with an electrically isolated channel
#79 | 2014-05-08Method and structure for forming a localized SOI finFET
#80 | 2014-04-17REPLACEMENT GATE WITH AN INNER DIELECTRIC SPACER
#81 | 2013-10-24ETCH STOP LAYER FORMATION IN METAL GATE PROCESS
#82 | 2013-10-24Etch stop layer formation in metal gate process
#83 | 2013-10-03REPLACEMENT GATE WITH REDUCED GATE LEAKAGE CURRENT
#84 | 2013-10-03Replacement Gate With Reduced Gate Leakage Current
#85 | 2013-08-01Replacement metal gate structures providing independent control on work function and gate leakage current
#86 | 2013-07-25Self-aligned contacts for high k/metal gate process flow
#87 | 2013-07-18High capacitance trench capacitor
#88 | 2013-06-27Source-drain extension formation in replacement metal gate transistor device
#89 | 2013-06-27SOURCE-DRAIN EXTENSION FORMATION IN REPLACEMENT METAL GATE TRANSISTOR DEVICE
#90 | 2012-10-18Integration of fin-based devices and ETSOI devices
#91 | 2012-10-11Electrical fuse formed by replacement metal gate process
#92 | 2012-08-07Integration of fin-based devices and ETSOI devices
#93 | 2012-07-12Self-aligned contacts for high k/metal gate process flow
#94 | 2012-07-05Method and structure for forming capacitors and memory devices on semiconductor-on-insulator (SOI) substrates
#95 | 2012-05-31Replacement metal gate structures providing independent control on work function and gate leakage current
#96 | 2012-03-15High capacitance trench capacitor
#97 | 2011-04-21Electrically conductive path forming below barrier oxide layer and integrated circuit
#98 | 2010-07-08Methods of fabricating P-I-N diodes, structures for P-I-N diodes and design structure for P-I-N diodes
#99 | 2010-07-01Vertical metal-insulator-metal (MIM) capacitor using gate stack, gate spacer and contact via
#100 | 2010-05-06Patterned strained semiconductor substrate and device
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