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Inventor profile of:

Sung Yi

City:

Suwon-si

Country:

South Korea

Published Applications:

26

Last publication date:

2012-06-21

Top Assignees for applications by Sung Yi

The entities that hold a legal rights for patent applications filed by inventor Yi Sung:

Recent patent applications by Yi Sung

Sung Yi from Suwon-si, KR has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2012-06-21
US20120152886A1
Electricity

METHOD OF MANUFACTURING SUBSTRATE FOR CAPACITOR-EMBEDDED PRINTED CIRCUIT BOARD AND CAPACITOR-EMBEDDED PRINTED CIRCUIT BOARD

 #2 | 2012-05-24
US20120129297A1
Electricity

METHOD OF MANUFACTURING WAFER LEVEL PACKAGE

 #3 | 2012-01-19
US20120015500A1
Electricity

Method of manufacturing wafer level package

 #4 | 2011-05-05
US20110099779A1
Electricity

Method of manufacturing capacitor-embedded PCB

 #5 | 2011-02-17
US20110035938A1
Electricity

Method of manufacturing a capacitor-embedded printed circuit board

 #6 | 2010-11-18
US20100288739A1
Performing operations; transporting

LASER PROCESSING DEVICE

 #7 | 2010-08-26
US20100214719A1
Electricity

CAPACITOR AND METHOD OF MANUFACTURING THE SAME

 #8 | 2010-06-10
US20100142170A1
Electricity

Method of manufacturing a chip embedded printed circuit board

 #9 | 2010-06-10
US20100142116A1
Electricity

CAPACITOR

 #10 | 2010-06-03
US20100134991A1
Electricity

Method of manufacturing a chip embedded printed circuit board

 #11 | 2010-06-03
US20100133680A1
Electricity

Wafer level package with removable chip protecting layer

 #12 | 2010-03-04
US20100052164A1
Electricity

Wafer level package and method of manufacturing the same

 #13 | 2009-12-17
US20090309216A1
Electricity

Wafer level package and manufacturing method thereof

 #14 | 2009-12-10
US20090305105A1
Electricity

Fuel cell and method for manufacturing the same

 #15 | 2009-10-01
US20090244864A1
Electricity

Substrate for capacitor-embedded printed circuit board, capacitor-embedded printed circuit board and manufacturing method thereof

 #16 | 2009-07-16
US20090178840A1
Electricity

PCB and manufacturing method thereof

 #17 | 2009-05-14
US20090124075A1
Electricity

Method of manufacturing a wafer level package that uses the same seed layer for selectively electroplating a rewiring pattern and a conductive pillar

 #18 | 2009-04-02
US20090087951A1
Electricity

Method of manufacturing wafer level package

 #19 | 2009-03-19
US20090073667A1
Electricity

Semiconductor chip package and printed circuit board

 #20 | 2009-03-19
US20090072335A1
Electricity

Image sensor package

 #21 | 2009-02-26
US20090049686A1
Electricity

Method of manufacturing component-embedded printed circuit board

 #22 | 2009-02-19
US20090046409A1
Electricity

Capacitor-embedded printed circuit board and manufacturing method thereof

 #23 | 2009-02-19
US20090045441A1
Electricity

CMOS image sensor package

 #24 | 2009-01-29
US20090025195A1
Electricity

Method of manufacturing capacitor-embedded PCB

 #25 | 2008-09-04
US20080212288A1
Electricity

Electronic component package and manufacturing method thereof

 #26 | 2008-09-04
US20080211083A1
Electricity

Electronic package and manufacturing method thereof
InventorID:

3076946 ⎘