Michael Danek

City:

Cupertino, California

Country:

United States

Published Applications:

Last publication date:

2012-06-14

Top Assignees for applications by Michael Danek

The entities that hold a legal rights for patent applications filed by inventor Danek Michael:

Michael Danek from Cupertino, US has applied for patents for these inventions. The list has both pending applications and granted patents:

BOTTOM UP FILL IN HIGH ASPECT RATIO TRENCHES

Method for depositing thin tungsten film with low resistivity and robust micro-adhesion characteristics

Method for depositing thin tungsten film with low resistivity and robust micro-adhesion characteristics

InventorID:

3076970 ⎘