Gyeonggi-do
South Korea
24
2025-08-14
The entities that hold a legal rights for patent applications filed by inventor Lee Jong-Joo:
Jong-Joo Lee from Gyeonggi-do, KR has applied for patents for these inventions. The list has both pending applications and granted patents:
MEMORY SYSTEM INCLUDING A SUB-CONTROLLER AND OPERATING METHOD OF THE SUB-CONTROLLER
#2 | 2024-11-28STORAGE DEVICE BASED ON DAISY CHAIN TOPOLOGY
#3 | 2024-06-27Memory system including a sub-controller and operating method of the sub-controller
#4 | 2023-04-13Storage device based on daisy chain topology
#5 | 2022-12-08Memory system including a sub-controller and operating method of the sub-controller
#6 | 2013-06-27Semiconductor chips having redistributed power/ground lines directly connected to power/ground lines of internal circuits and methods of fabricating the same
#7 | 2012-05-03Semiconductor chips having redistributed power/ground lines directly connected to power/ground lines of internal circuits and methods of fabricating the same
#8 | 2011-12-29Chip stack package
#9 | 2010-09-16Semiconductor device having a conductive bump
#10 | 2010-05-13Planar multi semiconductor chip package
#11 | 2009-08-27Semiconductor chips having redistributed power/ground lines directly connected to power/ground lines of internal circuits and methods of fabricating the same
#12 | 2009-04-30Chip stack package
#13 | 2009-03-12Stack chip and stack chip package having the same
#14 | 2008-11-27Method of fabricating a circuit board and semiconductor package.
#15 | 2008-09-04Planar multi semiconductor chip package and method of manufacturing the same
#16 | 2008-06-19Printed circuit board having coplanar LC balance
#17 | 2008-06-05High I/O semiconductor chip package and method of manufacturing the same
#18 | 2007-07-26Stack chip and stack chip package having the same
#19 | 2007-07-19Package board having internal terminal interconnection and semiconductor package employing the same
#20 | 2007-02-08Multilayered circuit substrate and semiconductor package structure using the same
#21 | 2006-10-05Semiconductor chips having redistributed power/ground lines directly connected to power/ground lines of internal circuits and methods of fabricating the same
#22 | 2006-06-29Semiconductor package module without a solder ball and method of manufacturing the semiconductor package module
#23 | 2006-06-22Packaged semiconductor die and manufacturing method thereof
#24 | 2005-09-15Semiconductor package having heat spreader and package stack using the same
307746 ⎘