Cheonan-si
South Korea
13
2015-02-26
The entities that hold a legal rights for patent applications filed by inventor YEOM Kun-Dae:
Kun-Dae YEOM from Cheonan-si, KR has applied for patents for these inventions. The list has both pending applications and granted patents:
Semiconductor package including multiple chips and separate groups of leads
#2 | 2014-08-14Semiconductor package including multiple chips and separate groups of leads
#3 | 2013-06-27SEMICONDUCTOR PACKAGE HAVING INTERPOSER COMPRISING A PLURALITY OF SEGMENTS
#4 | 2012-08-30Semiconductor package including multiple chips and separate groups of leads
#5 | 2012-01-12High density chip stacked package, package-on-package and method of fabricating the same
#6 | 2011-12-15STACK-TYPE SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
#7 | 2011-08-18Land grid array package capable of decreasing a height difference between a land and a solder resist
#8 | 2010-05-13Semiconductor package including multiple chips and separate groups of leads
#9 | 2008-12-25Semiconductor packages including thermal stress buffers and methods of manufacturing the same
#10 | 2008-05-29Method of fabricating electronic device having sacrificial anode, and electronic device fabricated by the same
#11 | 2008-01-24Stack type semiconductor package and method of fabricating the same
#12 | 2006-03-09Package having dummy package substrate and method of fabricating the same
#13 | 2006-03-09Package having dummy package substrate and method of fabricating the same
307752 ⎘