Inventor profile of:

Gregory John McAvoy

City:

Balmain

Country:

Australia

Published Applications:

178

Last publication date:

2012-12-13

Top Assignees for applications by Gregory John McAvoy

The entities that hold a legal rights for patent applications filed by inventor McAvoy Gregory John:

Recent patent applications by McAvoy Gregory John

Gregory John McAvoy from Balmain, AU has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2012-12-13
US20120314004A1
Performing operations; transporting

Inkjet printhead having titanium aluminium nitride heater elements

#2 | 2012-01-26
US20120019601A1
Performing operations; transporting

MICRO-ELECTROMECHANICAL NOZZLE ARRANGEMENT WITH PYRAMIDAL INK CHAMBER FOR AN INKJET PRINTHEAD

#3 | 2011-04-21
US20110090286A1
Performing operations; transporting

Printhead integrated circuit having exposed active beam coated with polymer layer

#4 | 2011-03-03
US20110050806A1
Performing operations; transporting

Crack-resistant thermal bend actuator

#5 | 2011-03-03
US20110047781A1
Chemistry; metallurgy

Method of fabricating crack-resistant thermal bend actuator

#6 | 2011-01-27
US20110020965A1
Performing operations; transporting

Method of fabricating printhead integrated circuit with backside electrical connections

#7 | 2011-01-27
US20110020964A1
Performing operations; transporting

Method of fabricating inkjet printhead assembly having backside electrical connections

#8 | 2011-01-27
US20110018941A1
Performing operations; transporting

Printhead integrated comprising through-silicon connectors

#9 | 2011-01-27
US20110018940A1
Performing operations; transporting

Printhead integrated circuit configured for backside electrical connection

#10 | 2011-01-27
US20110018939A1
Performing operations; transporting

Inkjet printhead assembly having backside electrical connection

#11 | 2011-01-27
US20110018937A1
Performing operations; transporting

PRINTHEAD HAVING INK EJECTION FACE COMPLEMENTING INK OR OTHER FEATURES OF PRINTHEAD

#12 | 2011-01-27
US20110018936A1
Performing operations; transporting

Printhead having polymer incorporating nanoparticles coated on ink ejection face

#13 | 2011-01-27
US20110018935A1
Performing operations; transporting

Printhead having polysilsesquioxane coating on ink ejection face

#14 | 2010-12-16
US20100315468A1
Performing operations; transporting

Inkjet nozzle assembly with thermal bend actuator defining moving portion of nozzle chamber roof

#15 | 2010-12-02
US20100302320A1
Performing operations; transporting

HEATER ASSEMBLY FOR PRINTHEAD

#16 | 2010-11-04
US20100277551A1
Performing operations; transporting

MICRO-ELECTROMECHANICAL NOZZLE ARRANGEMENT HAVING CANTILEVERED ACTUATOR

#17 | 2010-10-28
US20100271434A1
Performing operations; transporting

PRINTHEAD WITH MOVABLE EJECTION ORIFICE

#18 | 2010-10-28
US20100271430A1
Performing operations; transporting

PRINTHEAD PROVIDED WITH INDIVIDUAL NOZZLE ENCLOSURES

#19 | 2010-09-16
US20100231652A1
Performing operations; transporting

Inkjet nozzle assembly having bilayered passive beam

#20 | 2010-09-02
US20100220155A1
Performing operations; transporting

Thermal ink jet printhead

#21 | 2010-09-02
US20100220142A1
Performing operations; transporting

Printhead with ink distribution through aligned apertures

#22 | 2010-08-19
US20100207997A1
Performing operations; transporting

Printhead nozzle arrangement having interleaved heater elements

#23 | 2010-07-08
US20100171795A1
Performing operations; transporting

Inkjet printhead intergrated configured to minimize thermal losses

#24 | 2010-06-17
US20100149623A1
Physics

METHOD OF FABRICATING MICRO-MIRROR ASSEMBLY

#25 | 2010-06-17
US20100149622A1
Physics

DIGITAL MICRO-MIRROR DEVICE

#26 | 2010-06-17
US20100149279A1
Performing operations; transporting

Inkjet nozzle assembly having heater element bonded to chamber wall via dielectric layer

#27 | 2010-06-17
US20100149266A1
Performing operations; transporting

MEMS integrated circuit with polymerized siloxane layer

#28 | 2010-06-17
US20100149255A1
Performing operations; transporting

Printhead nozzle arrangement having ink ejecting actuators annularly arranged around ink ejection port

#29 | 2010-05-27
US20100128087A1
Performing operations; transporting

Inkjet nozzle assembly having moving roof structure and sealing bridge

#30 | 2010-05-27
US20100128086A1
Performing operations; transporting

Printhead including moving portions and sealing bridges

#31 | 2010-05-27
US20100128082A1
Performing operations; transporting

Method of fabricating nozzle assembly having moving roof structure and sealing bridge

#32 | 2010-05-06
US20100110147A1
Performing operations; transporting

Inkjet nozzle assembly with thermal bend actuator defining part of nozzle chamber roof

#33 | 2010-04-29
US20100103216A1
Performing operations; transporting

MEMS fluid sensor

#34 | 2010-04-15
US20100091072A1
Performing operations; transporting

Inkjet printhead nozzle arrangement having non-coincident low mass electrode and heater element

#35 | 2010-04-15
US20100090296A1
Performing operations; transporting

Wafer assembly comprising MEMS wafer with polymerized siloxane attachment surface

#36 | 2010-04-01
US20100079556A1
Physics

Inkjet printer

#37 | 2010-04-01
US20100079550A1
Performing operations; transporting

Efficient inkjet nozzle assembly

#38 | 2010-04-01
US20100079549A1
Performing operations; transporting

Inkjet printer with small drop size

#39 | 2010-03-25
US20100073432A1
Performing operations; transporting

Ink jet printhead incorporating heater element proportionally sized to drop size

#40 | 2010-03-25
US20100073430A1
Performing operations; transporting

Ink jet nozzle arrangement with a segmented actuator nozzle chamber cover

#41 | 2010-02-25
US20100045749A1
Performing operations; transporting

Thermal bend actuator comprising bilayered passive beam

#42 | 2010-02-11
US20100033539A1
Performing operations; transporting

Printhead with individual nozzle firing frequency at least once per decap time

#43 | 2010-02-11
US20100033538A1
Performing operations; transporting

Inkjet nozzle assembly having thermoelastic actuator beam disposed on nozzle chamber roof

#44 | 2010-01-28
US20100020843A1
Performing operations; transporting

Thermal bend actuator material selection

#45 | 2010-01-07
US20100002055A1
Performing operations; transporting

Printhead nozzle arrangement with radially disposed actuators

#46 | 2009-12-24
US20090318312A1
Performing operations; transporting

Microfluidic system comprising mechanically-actuated microfluidic pinch valve

#47 | 2009-12-24
US20090317302A1
Performing operations; transporting

Microfluidic System Comprising MEMS Integrated Circuit

#48 | 2009-12-24
US20090317301A1
Performing operations; transporting

Bonded Microfluidics System Comprising MEMS-Actuated Microfluidic Devices

#49 | 2009-12-24
US20090317298A1
Performing operations; transporting

Microfluidic system comprising microfluidic pump, mixer or valve

#50 | 2009-12-24
US20090317273A1
Mechanical engineering

Thermal bend actuated microfluidic peristaltic pump

#51 | 2009-12-24
US20090317272A1
Performing operations; transporting

MEMS integrated circuit comprising peristaltic microfluidic pump

#52 | 2009-12-24
US20090315126A1
Mechanical engineering

Bonded Microfluidic System Comprising Thermal Bend Actuated Valve

#53 | 2009-12-24
US20090314972A1
Mechanical engineering

Mechanically-actuated microfluidic diaphragm valve

#54 | 2009-12-24
US20090314971A1
Mechanical engineering

Mechanically-actuated microfluidic valve

#55 | 2009-12-24
US20090314970A1
Mechanical engineering

Mechanically-actuated microfluidic pinch valve

#56 | 2009-12-24
US20090314368A1
Performing operations; transporting

Microfluidic System Comprising Pinch Valve and On-Chip MEMS Pump

#57 | 2009-12-24
US20090314367A1
Mechanical engineering

Bonded Microfluidics System Comprising CMOS-Controllable Microfluidic Devices

#58 | 2009-12-24
US20090314365A1
Mechanical engineering

MEMS integrated circuit comprising microfluidic diaphragm valve

#59 | 2009-11-12
US20090278899A1
Performing operations; transporting

Printhead integrated circuit comprising polymeric cover layer

#60 | 2009-11-12
US20090278876A1
Performing operations; transporting

Short pulsewidth actuation of thermal bend actuator

#61 | 2009-11-05
US20090273646A1
Performing operations; transporting

Thermal bend actuator comprising bent active beam having resistive heating bars

#62 | 2009-10-29
US20090267993A1
Performing operations; transporting

Printhead integrated circuit with petal formation ink ejection actuator

#63 | 2009-10-22
US20090262166A1
Performing operations; transporting

Printhead having plural fluid ejection heating elements

#64 | 2009-10-01
US20090244197A1
Performing operations; transporting

Thermal Inkjet Printhead With Double Omega Shaped Heating Element

#65 | 2009-08-27
US20090212658A1
Performing operations; transporting

MICRO--ELECTROMECHANICAL ACTUATOR WITH SPACER SEPARATED LAYERS

#66 | 2009-08-20
US20090207208A1
Performing operations; transporting

Nozzle arrangement using unevenly heated thermal actuators

#67 | 2009-08-06
US20090195621A1
Performing operations; transporting

Inkjet nozzle arrangement having interleaved heater elements

#68 | 2009-06-25
US20090160912A1
Performing operations; transporting

Self-cooling high nozzle density ink jet nozzle arrangement

#69 | 2009-06-11
US20090147044A1
Performing operations; transporting

PRESSURE CAPPING OF INKJET NOZZLES

#70 | 2009-06-11
US20090147043A1
Performing operations; transporting

INKJET PRINTER COMPRISING INTEGRATED CAPPER AND CLEANER

#71 | 2009-06-11
US20090147042A1
Performing operations; transporting

MICROCAPPING OF INKJET NOZZLES

#72 | 2009-06-04
US20090141109A1
Performing operations; transporting

Printhead with pressure-dampening structures

#73 | 2009-06-04
US20090141108A1
Physics

Printer with minimal distance between pressure-dampening structures and nozzles

#74 | 2009-06-04
US20090141082A1
Performing operations; transporting

Printhead with redundant nozzle chamber inlets for minimizing effects of blockages

#75 | 2009-06-04
US20090139961A1
Performing operations; transporting

Metal film protection during printhead fabrication with minimum number of MEMS processing steps

#76 | 2009-05-14
US20090122113A1
Performing operations; transporting

Printhead having nozzle arrangements with radial actuators

#77 | 2009-04-16
US20090096834A1
Performing operations; transporting

Printhead nozzle arrangement with a roof structure having a nozzle rim supported by a series of struts

#78 | 2009-04-16
US20090095709A1
Performing operations; transporting

METHOD OF ETCHING INK SUPPLY CHANNEL WITH HYDROPHILIC SIDEWALLS

#79 | 2009-03-19
US20090073233A1
Performing operations; transporting

Micro-electromechanical nozzle arrangement with a roof structure for minimizing wicking

#80 | 2009-02-19
US20090046126A1
Performing operations; transporting

Printhead with droplet redirecting nozzle guard

#81 | 2009-01-01
US20090002459A1
Performing operations; transporting

Printhead with low viscous drag droplet ejection

#82 | 2009-01-01
US20090002421A1
Performing operations; transporting

Inkjet printhead comprising bonded heater element and dielectric layer with low thermal product

#83 | 2008-12-25
US20080316270A1
Performing operations; transporting

Printhead assembly for re-directing ink droplets

#84 | 2008-12-25
US20080316269A1
Performing operations; transporting

Micro-electromechanical nozzle arrangement having cantilevered actuators

#85 | 2008-12-25
US20080316256A1
Performing operations; transporting

Printhead assembly with sandwiched power supply arrangement

#86 | 2008-12-18
US20080309729A1
Performing operations; transporting

Printhead integrated circuit comprising inkjet nozzle assemblies having connector posts

#87 | 2008-12-18
US20080309728A1
Performing operations; transporting

Method of forming connection between electrode and actuator in an inkjet nozzle assembly

#88 | 2008-12-11
US20080303872A1
Performing operations; transporting

Nozzle arrangement for an inkjet printer configured to minimize thermal losses

#89 | 2008-12-04
US20080297566A1
Performing operations; transporting

Inkjet printhead nozzle arrangement having non-coincident electrodes

#90 | 2008-11-20
US20080284821A1
Performing operations; transporting

Nozzle arrangement for an inkjet printhead with a diffusion barrier

#91 | 2008-10-02
US20080239009A1
Performing operations; transporting

Inkjet printhead having MEMS sensors for directionally heated ink ejection

#92 | 2008-09-18
US20080227229A1
Performing operations; transporting

Method of fabrication MEMS integrated circuits

#93 | 2008-09-18
US20080225083A1
Performing operations; transporting

Printhead having moving roof structure and mechanical seal

#94 | 2008-09-18
US20080225082A1
Performing operations; transporting

Printhead having hydrophobic polymer coated on ink ejection face

#95 | 2008-09-18
US20080225078A1
Performing operations; transporting

Printhead including seal membrane

#96 | 2008-09-18
US20080225077A1
Performing operations; transporting

Method of fabricating printhead using metal film for protecting hydrophobic ink ejection face

#97 | 2008-09-18
US20080225076A1
Performing operations; transporting

Method of fabricating printhead having hydrophobic ink ejection face

#98 | 2008-09-04
US20080211843A1
Performing operations; transporting

Method of operating a nozzle chamber having radially positioned actuators

#99 | 2008-08-28
US20080204492A1
Performing operations; transporting

Method of producing thermoelastic inkjet actuator

#100 | 2008-08-14
US20080192091A1
Performing operations; transporting

Printhead with ejection orifice in flexible element

InventorID:

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