Osaka
Japan
17
2012-02-02
The entities that hold a legal rights for patent applications filed by inventor AKEMI Hitoshi:
Hitoshi AKEMI from Osaka, JP has applied for patents for these inventions. The list has both pending applications and granted patents:
ADHESIVE PATCH AND PATCH PREPARATION
#2 | 2011-10-06PATCH PREPARATION AND PRODUCTION METHOD THEREOF
#3 | 2011-09-01PRESSURE-SENSITIVE ADHESIVE COMPOSITION APPLICABLE TO NAIL AND ADHESIVE AGENT FOR NAIL
#4 | 2011-03-10ADHESIVE PREPARATION CONTAINING DONEPEZIL, AND PACKAGE OF THE SAME
#5 | 2010-08-12Patch and patch preparation
#6 | 2010-07-15PRESSURE-SENSITIVE ADHESIVE COMPOSITION APPLICABLE TO NAIL AND ADHESIVE AGENT FOR NAIL
#7 | 2010-07-06Adhering member and method for producing adhering member
#8 | 2010-01-14PERCUTANEOUSLY ABSORBABLE PREPARATION
#9 | 2009-07-02Patch package structure
#10 | 2009-07-02Patch package structure
#11 | 2009-02-19Pressure-sensitive adhesive composition applicable to nail and adhesive agent for nail
#12 | 2008-06-26Manufacturing apparatus of transdermal absorption preparation
#13 | 2008-06-05Percutaneously absorbable preparation
#14 | 2008-06-05Stabilized donepezil-containing patch preparation
#15 | 2006-11-02Adhesive and laminate
#16 | 2006-10-19Adhesive preparation
#17 | 2006-08-03Pressure-sensitive adhesive composition applicable to nail and adhesive agent for nail
3088194 ⎘