Florian AMMER

City:

Ergoldsbach

Country:

Germany

Published Applications:

Last publication date:

2012-02-09

Top Assignees for applications by Florian AMMER

The entities that hold a legal rights for patent applications filed by inventor AMMER Florian:

Florian AMMER from Ergoldsbach, DE has applied for patents for these inventions. The list has both pending applications and granted patents:

Semiconductor package and method of attaching semiconductor dies to substrates

INTEGRATED DEVICE

SEMICONDUCTOR PACKAGE AND METHOD OF ATTACHING SEMICONDUCTOR DIES TO SUBSTRATES

COPPER ON ORGANIC SOLDERABILITY PRESERVATIVE (OSP) INTERCONNECT

INTEGRATED DEVICE

InventorID:

3094563 ⎘