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Inventor profile of:

Renhe Jia

City:

Berkeley, California

Country:

United States

Published Applications:

25

Last publication date:

2012-02-16

Top Assignees for applications by Renhe Jia

The entities that hold a legal rights for patent applications filed by inventor Jia Renhe:

Recent patent applications by Jia Renhe

Renhe Jia from Berkeley, US has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2012-02-16
US20120037181A1
Performing operations; transporting

Cleaning methods for improved photovoltaic module efficiency

 #2 | 2009-01-08
US20090008600A1
Performing operations; transporting

METHOD AND COMPOSITION FOR POLISHING A SUBSTRATE

 #3 | 2008-01-24
US20080020682A1
Performing operations; transporting

Method for conditioning a polishing pad

 #4 | 2007-11-01
US20070254485A1
Electricity

ABRASIVE COMPOSITION FOR ELECTROCHEMICAL MECHANICAL POLISHING

 #5 | 2007-10-11
US20070235344A1
Performing operations; transporting

Process for high copper removal rate with good planarization and surface finish

 #6 | 2007-08-09
US20070181442A1
Performing operations; transporting

Method and apparatus for foam removal in an electrochemical mechanical substrate polishing process

 #7 | 2007-07-12
US20070161250A1
Electricity

Method for electrochemically mechanically polishing a conductive material on a substrate

 #8 | 2007-07-12
US20070158207A1
Performing operations; transporting

Methods for electrochemical processing with pre-biased cells

 #9 | 2007-07-05
US20070153453A1
Chemistry; metallurgy

Fully conductive pad for electrochemical mechanical processing

 #10 | 2007-07-05
US20070151866A1
Performing operations; transporting

Substrate polishing with surface pretreatment

 #11 | 2007-06-28
US20070144915A1
Chemistry; metallurgy

PROCESS AND COMPOSITION FOR PASSIVATING A SUBSTRATE DURING ELECTROCHEMICAL MECHANICAL POLISHING

 #12 | 2007-05-10
US20070102303A1
Performing operations; transporting

Method and composition for electrochemically polishing a conductive material on a substrate

 #13 | 2007-05-03
US20070099552A1
Performing operations; transporting

Conductive pad with ion exchange membrane for electrochemical mechanical polishing

 #14 | 2007-05-03
US20070095677A1
Performing operations; transporting

Electrochemical method for Ecmp polishing pad conditioning

 #15 | 2007-03-22
US20070062815A1
Performing operations; transporting

METHOD FOR STABILIZED POLISHING PROCESS

 #16 | 2006-11-09
US20060249395A1
Chemistry; metallurgy

Process and composition for electrochemical mechanical polishing

 #17 | 2006-11-09
US20060249394A1
Chemistry; metallurgy

Process and composition for electrochemical mechanical polishing

 #18 | 2006-10-05
US20060219663A1
Electricity

Metal CMP process on one or more polishing stations using slurries with oxidizers

 #19 | 2006-09-07
US20060196778A1
Performing operations; transporting

Tungsten electroprocessing

 #20 | 2006-08-03
US20060169674A1
Chemistry; metallurgy

Method and composition for polishing a substrate

 #21 | 2006-03-02
US20060046623A1
Performing operations; transporting

Method and apparatus for reduced wear polishing pad conditioning

 #22 | 2006-02-02
US20060021974A1
Electricity

Method and composition for polishing a substrate

 #23 | 2005-10-20
US20050233578A1
Performing operations; transporting

Method and composition for polishing a substrate

 #24 | 2005-10-06
US20050218010A1
Chemistry; metallurgy

Process and composition for conductive material removal by electrochemical mechanical polishing

 #25 | 2005-04-14
US20050077188A1
Performing operations; transporting

Endpoint for electrochemical processing
InventorID:

3096987 ⎘