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Inventor profile of:

Hee Jin Lee

City:

Gyeonggi-do

Country:

South Korea

Published Applications:

6

Last publication date:

2013-06-27

Top Assignees for applications by Hee Jin Lee

The entities that hold a legal rights for patent applications filed by inventor Lee Hee Jin:

SAMSUNG ELECTRONICS CO., LTD. 3 Gyeonggi-Do, South Korea
SAMSUNG ELECTRONICS CO. LTD. 1 Suwon-si, Gyeonggi-do, South Korea
SAMSUNG ELECTRONICS CO., LTD. 1 Gyeonggid-do, South Korea

Recent patent applications by Lee Hee Jin

Hee Jin Lee from Gyeonggi-do, KR has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2013-06-27

US20130163345A1

SEMICONDUCTOR MEMORY DEVICE AND METHOD OF OPERATING THE SAME

#2 | 2011-03-17

US20110064604A1

Chemistry; metallurgy

PARTICULATE TIN POWER AND MANUFACTURING METHOD THEREOF

#3 | 2008-05-01

US20080099909A1

Wafer stacked package having vertical heat emission path and method of fabricating the same

#4 | 2007-11-01

US20070252271A1

Semiconductor memory module having an oblique memory chip

#5 | 2007-11-01

US20070252257A1

SEMICONDUCTOR PACKAGE STRUCTURES HAVING HEAT DISSIPATIVE ELEMENT DIRECTLY CONNECTED TO INTERNAL CIRCUIT AND METHODS OF FABRICATING THE SAME

#6 | 2007-06-07

US20070126114A1

HEAT-DISSIPATING MEMBER, METHOD OF MANUFACTURING THE SAME, SEMICONDUCTOR MODULE HAVING THE HEAT-DISSIPATING MEMBER, AND METHOD OF MANUFACTURING THE SEMICONDUCTOR MODULE

InventorID:

309921 ⎘