Gyeonggid-do
South Korea
57
2009-10-01
38
2011-04-12
These are the the leading inventors for applications assigned to SAMSUNG ELECTRONICS CO., LTD.:
SAMSUNG ELECTRONICS CO., LTD. based in Gyeonggid-do, KR has been assigned the rights to these inventions. The list includes both Pending Applications and Patent Grants:
Metal capacitor including lower metal electrode having hemispherical metal grains
#2 | 2009-01-08NONVOLATILE MEMORY DEVICE AND METHOD OF FABRICATING THE SAME
#3 | 2008-09-18 ✅ Patent 7,656,742 granted on 2010-02-02Circuit and method for sampling valid command using extended valid address window in double pumped address scheme memory device
#4 | 2008-05-01MULTI-GROUND SHIELDING SEMICONDUCTOR PACKAGE, METHOD OF FABRICATING THE PACKAGE, AND METHOD OF PREVENTING NOISE USING MULTI-GROUND SHIELDING
#5 | 2008-03-27STACKED SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
#6 | 2008-03-27STACKED SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
#7 | 2008-03-27 ✅ Patent 7,629,677 granted on 2009-12-08Semiconductor package with inner leads exposed from an encapsulant
#8 | 2008-02-21 ✅ Patent 7,977,724 granted on 2011-07-12Capacitor and method of manufacturing the same comprising a stabilizing member
#9 | 2008-02-14 ✅ Patent 7,465,988 granted on 2008-12-16Semiconductor device and method of manufacturing the same
#10 | 2007-09-13 ✅ Patent 8,009,895 granted on 2011-08-30Semiconductor wafer analysis system
#11 | 2007-09-06 ✅ Patent 7,984,261 granted on 2011-07-19Memory expansion structure in multi-path accessible semiconductor memory device
#12 | 2007-08-30RIGID FLEXIBLE PRINTED CIRCUIT BOARD HAVING OPENINGS
#13 | 2007-08-16METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE WITH PROTECTION LAYER
#14 | 2007-08-16 ✅ Patent 7,773,444 granted on 2010-08-10Semiconductor memory device and data write and read methods thereof
#15 | 2007-08-16 ✅ Patent 7,463,072 granted on 2008-12-09Small swing signal receiver for low power consumption and semiconductor device including the same
#16 | 2007-08-09TEST PATTERN AND METHOD FOR MEASURING SILICON ETCHING DEPTH
#17 | 2007-08-09 ✅ Patent 7,582,542 granted on 2009-09-01Die attaching method
#18 | 2007-08-09 ✅ Patent 7,479,818 granted on 2009-01-20Sense amplifier flip flop
#19 | 2007-08-02METAL CAPACITOR INCLUDING LOWER METAL ELECTRODE HAVING HEMISPHERICAL METAL GRAINS
#20 | 2007-08-02 ✅ Patent 7,443,756 granted on 2008-10-28Memory device having redundancy fuse blocks arranged for testing
#21 | 2007-07-19 ✅ Patent 7,532,538 granted on 2009-05-12Tri-state output driver arranging method and memory device using the same
#22 | 2007-07-19WAFER LEVEL CHIP SCALE PACKAGE HAVING REROUTING LAYER AND METHOD OF MANUFACTURING THE SAME
#23 | 2007-07-12METHOD OF FABRICATING A SEMICONDUCTOR DEVICE HAVING A HYDROGEN SOURCE LAYER
#24 | 2007-07-12 ✅ Patent 7,534,035 granted on 2009-05-19Temperature sensor for generating sectional temperature code and sectional temperature detection method
#25 | 2007-07-12 ✅ Patent 7,581,881 granted on 2009-09-01Temperature sensor using ring oscillator and temperature detection method using the same
#26 | 2007-07-12 ✅ Patent 7,556,712 granted on 2009-07-07Laser cleaning of backside of wafer for photolithographic processing
#27 | 2007-07-05 ✅ Patent 7,476,924 granted on 2009-01-13Semiconductor device having recessed landing pad and its method of fabrication
#28 | 2007-06-28 ✅ Patent 7,420,871 granted on 2008-09-02Synchronous semiconductor memory device
#29 | 2007-06-28 ✅ Patent 7,925,820 granted on 2011-04-12Nonvolatile semiconductor memory device and program method therefor
#30 | 2007-06-28 ✅ Patent 7,630,223 granted on 2009-12-08Memory device and method of arranging signal and power lines
#31 | 2007-06-21 ✅ Patent 7,459,957 granted on 2008-12-02Fuse circuit with leakage path elimination
#32 | 2007-06-21 ✅ Patent 7,566,961 granted on 2009-07-28Multi-stacked package and method of manufacturing the same
#33 | 2007-06-21ADHESIVE SHEET, SEMICONDUCTOR DEVICE HAVING THE SAME, MULTI-STACKED PACKAGE HAVING THE SAME, AND METHODS OF MANUFACTURING A SEMICONDUCTOR DEVICE AND A MULTI-STACKED PACKAGE
#34 | 2007-06-14DEVICE AND METHOD FOR REDUCING REFRESH CURRENT CONSUMPTION
#35 | 2007-06-07HEAT-DISSIPATING MEMBER, METHOD OF MANUFACTURING THE SAME, SEMICONDUCTOR MODULE HAVING THE HEAT-DISSIPATING MEMBER, AND METHOD OF MANUFACTURING THE SEMICONDUCTOR MODULE
#36 | 2007-06-07 ✅ Patent 7,633,136 granted on 2009-12-15Semiconductor device and method of manufacturing the same
#37 | 2007-05-31 ✅ Patent 7,394,720 granted on 2008-07-01Circuit and method for sampling valid command using extended valid address window in double pumped address scheme memory device
#38 | 2007-05-31 ✅ Patent 7,821,860 granted on 2010-10-26Stable temperature adjustment for refresh control
#39 | 2007-05-31 ✅ Patent 7,626,164 granted on 2009-12-01Method of scanning a substrate, and method and apparatus for analyzing crystal characteristics
#40 | 2007-05-24 ✅ Patent 7,696,032 granted on 2010-04-13Semiconductor device including a crystal semiconductor layer, its fabrication and its operation
#41 | 2007-05-24 ✅ Patent 7,807,542 granted on 2010-10-05Semiconductor device having storage node electrode with protection film thereon and method of fabricating the same
#42 | 2007-05-24 ✅ Patent 7,576,408 granted on 2009-08-18Fuse box, method of forming a fuse box, and fuse cutting method
#43 | 2007-05-17METHOD FOR OUTPUTTING INTERNAL TEMPERATURE DATA IN SEMICONDUCTOR MEMORY DEVICE AND CIRCUIT OF OUTPUTTING INTERNAL TEMPERATURE DATA THEREBY
#44 | 2007-05-17 ✅ Patent 7,547,977 granted on 2009-06-16Semiconductor chip having bond pads
#45 | 2007-05-17 ✅ Patent 7,825,523 granted on 2010-11-02Semiconductor chip having bond pads
#46 | 2007-05-17 ✅ Patent 7,297,596 granted on 2007-11-20Method of manufacturing a semiconductor device having a switching function
#47 | 2007-05-10MEMORY DEVICE WITH AUXILIARY SENSING
#48 | 2007-05-10SEMICONDUCTOR DEVICE WITH FUSE AND METHOD OF FABRICATING THE SAME
#49 | 2007-05-03 ✅ Patent 7,679,161 granted on 2010-03-16Semiconductor device comprising fuse sections
#50 | 2007-05-03SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME
#51 | 2007-04-26 ✅ Patent 7,612,573 granted on 2009-11-03Probe sensing pads and methods of detecting positions of probe needles relative to probe sensing pads
#52 | 2007-04-05 ✅ Patent 7,371,651 granted on 2008-05-13Flat-type capacitor for integrated circuit and method of manufacturing the same
#53 | 2007-04-05 ✅ Patent 7,474,564 granted on 2009-01-06Non-volatile memory device capable of changing increment of program voltage according to mode of operation
#54 | 2007-03-29INTEGRATED CIRCUIT CAPACITOR STRUCTURE
#55 | 2007-03-15 ✅ Patent 7,541,682 granted on 2009-06-02Semiconductor chip having bond pads
#56 | 2007-03-15 ✅ Patent 7,576,440 granted on 2009-08-18Semiconductor chip having bond pads and multi-chip package
#57 | 2007-02-22MAGNETIC TUNNEL JUNCTION STRUCTURE HAVING AN OXIDIZED BUFFER LAYER AND METHOD OF FABRICATING THE SAME
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