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Inventor profile of:

Gerald Lackner

City:

Arnoldstein

Country:

Austria

Published Applications:

Last publication date:

2023-10-19

Top Assignees for applications by Gerald Lackner

The entities that hold a legal rights for patent applications filed by inventor Lackner Gerald:

INFINEON TECHNOLOGIES AG 15 Neubiberg, Germany
INFINEON TECHNOLOGIES AUSTRIA AG 5 Villach, Austria
Infineon Technologies AG 2 , Germany

Recent patent applications by Lackner Gerald

Gerald Lackner from Arnoldstein, AT has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2023-10-19

US20230330769A1

Performing operations; transporting

Parent Substrate, Wafer Composite and Methods of Manufacturing Crystalline Substrates and Semiconductor Devices

#2 | 2023-06-01

US20230170233A1

Electricity

Method and apparatus for use in wafer processing

#3 | 2023-03-30

US20230100613A1

Electricity

WAFER CHUCK FOR A LASER BEAM WAFER DICING EQUIPMENT

#4 | 2023-03-30

US20230098233A1

Electricity

Wafer chuck for a laser beam wafer dicing equipment

#5 | 2022-06-09

US20220181211A1

Electricity

Composite wafer, semiconductor device and electronic component

#6 | 2021-07-15

US20210217640A1

Electricity

Method and apparatus for use in wafer processing

#7 | 2021-02-25

US20210053148A1

Performing operations; transporting

Parent substrate, wafer composite and methods of manufacturing crystalline substrates and semiconductor devices

#8 | 2020-08-27

US20200273750A1

Electricity

Composite wafer, semiconductor device and electronic component

#9 | 2019-04-25

US20190122909A1

Electricity

Method and apparatus for use in wafer processing

#10 | 2019-03-21

US20190088550A1

Electricity

Composite wafer, semiconductor device, electronic component and method of manufacturing a semiconductor device

#11 | 2018-09-13

US20180261487A1

Electricity

Wafer arrangement and method for processing a wafer

#12 | 2017-05-11

US20170133253A1

Electricity

Method and apparatus for use in wafer processing

#13 | 2016-03-24

US20160086838A1

Electricity

Wafer arrangement and method for processing a wafer

#14 | 2014-10-16

US20140306327A1

Electricity

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THEREOF

#15 | 2013-12-12

US20130328183A1

Electricity

Method for manufacturing semiconductor devices having a glass substrate

#16 | 2013-09-05

US20130228905A1

Electricity

Method for manufacturing semiconductor devices having a glass substrate

#17 | 2013-06-27

US20130164939A1

Electricity

Method, apparatus for holding and treatment of a substrate

#18 | 2012-11-22

US20120292757A1

Electricity

Semiconductor component with a front side and a back side metallization layer and manufacturing method thereof

#19 | 2012-10-04

US20120248631A1

Electricity

Method for manufacturing semiconductor devices having a glass substrate

#20 | 2012-09-06

US20120225544A1

Electricity

Method for producing a semiconductor component

#21 | 2012-01-19

US20120012994A1

Electricity

Method for manufacturing semiconductor devices having a glass substrate

#22 | 2009-01-01

US20090004824A2

Electricity

METHOD, APPARATUS FOR HOLDING AND TREATMENT OF A SUBSTRATE

#23 | 2008-03-13

US20080064184A1

Electricity

Method, apparatus for holding and treatment of a substrate

InventorID:

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