DECA Technologies Inc.

City:

Tempe, Arizona

Country:

United States

Published Applications:

Last publication date:

2013-07-04

Top Assignees for applications by DECA Technologies Inc.

The entities that hold a legal rights for patent applications filed by inventor DECA Technologies Inc.:

DECA TECHNOLOGIES INC 2 Tempe, AZ United States

Recent patent applications by DECA Technologies Inc.

DECA Technologies Inc. from Tempe, US has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2013-07-04

US20130168874A1

Electricity

Die up fully molded fan-out wafer level packaging

#2 | 2013-06-27

US20130167102A1

Physics

Adaptive patterning for panelized packaging

InventorID:

316543 ⎘