Tempe, Arizona
United States
46
2019-10-24
45
2020-10-27
These are the the leading inventors for applications assigned to DECA TECHNOLOGIES INC:
DECA TECHNOLOGIES INC based in Tempe, US has been assigned the rights to these inventions. The list includes both Pending Applications and Patent Grants:
Fully molded semiconductor package for power devices and method of making the same
#2 | 2019-05-09 ✅ Patent 10,573,601 granted on 2020-02-25Semiconductor device and method of unit specific progressive alignment
#3 | 2018-11-15 ✅ Patent 10,672,624 granted on 2020-06-02Method of making fully molded peripheral package on package device
#4 | 2018-09-13 ✅ Patent 10,720,417 granted on 2020-07-21Thermally enhanced fully molded fan-out module
#5 | 2018-09-06 ✅ Patent 10,373,870 granted on 2019-08-06Semiconductor device and method of packaging
#6 | 2018-04-19 ✅ Patent 10,373,902 granted on 2019-08-06Fully molded miniaturized semiconductor module
#7 | 2018-03-22 ✅ Patent 10,157,803 granted on 2018-12-18Semiconductor device and method of unit specific progressive alignment
#8 | 2017-09-07 ✅ Patent 10,056,304 granted on 2018-08-21Automated optical inspection of unit specific patterning
#9 | 2017-08-03 ✅ Patent 10,600,652 granted on 2020-03-24Semiconductor device processing method for material removal
#10 | 2017-06-29 ✅ Patent 10,373,913 granted on 2019-08-06Method of marking a semiconductor package
#11 | 2017-05-25 ✅ Patent 10,050,004 granted on 2018-08-14Fully molded peripheral package on package device
#12 | 2017-04-13 ✅ Patent 9,818,659 granted on 2017-11-14Multi-die package comprising unit specific alignment and unit specific routing
#13 | 2017-03-23 ✅ Patent 9,761,571 granted on 2017-09-12Thermally enhanced fully molded fan-out module
#14 | 2017-03-16 ✅ Patent 9,831,170 granted on 2017-11-28Fully molded miniaturized semiconductor module
#15 | 2017-02-02 ✅ Patent 9,754,835 granted on 2017-09-05Semiconductor device and method comprising redistribution layers
#16 | 2017-01-12 ✅ Patent 9,640,495 granted on 2017-05-02Semiconductor device processing method for material removal
#17 | 2016-11-10 ✅ Patent 9,978,655 granted on 2018-05-22Semiconductor device and method of adaptive patterning for panelized packaging with dynamic via clipping
#18 | 2016-11-03 ✅ Patent 9,502,397 granted on 2016-11-223D interconnect component for fully molded packages
#19 | 2016-09-08 ✅ Patent 9,613,830 granted on 2017-04-04Fully molded peripheral package on package device
#20 | 2016-06-16 ✅ Patent 9,613,912 granted on 2017-04-04Method of marking a semiconductor package
#21 | 2016-05-19 ✅ Patent 9,401,313 granted on 2016-07-26Automated optical inspection of unit specific patterning
#22 | 2016-03-31 ✅ Patent 9,576,919 granted on 2017-02-21Semiconductor device and method comprising redistribution layers
#23 | 2016-03-24 ✅ Patent 9,887,103 granted on 2018-02-06Semiconductor device and method of adaptive patterning for panelized packaging
#24 | 2016-03-03 ✅ Patent 9,520,364 granted on 2016-12-13Front side package-level serialization for packages comprising unique identifiers
#25 | 2016-01-28 ✅ Patent 10,204,803 granted on 2019-02-12Two step method of rapid curing a semiconductor polymer layer
#26 | 2015-12-17 ✅ Patent 9,397,069 granted on 2016-07-19Semiconductor device and method of adaptive patterning for panelized packaging with dynamic via clipping
#27 | 2015-07-02 ✅ Patent 9,177,926 granted on 2015-11-03Semiconductor device and method comprising thickened redistribution layers
#28 | 2015-05-26 ✅ Patent 9,040,316 granted on 2015-05-26Semiconductor device and method of adaptive patterning for panelized packaging with dynamic via clipping
#29 | 2015-04-30 ✅ Patent 9,337,086 granted on 2016-05-10Die up fully molded fan-out wafer level packaging
#30 | 2015-03-19 ✅ Patent 9,159,547 granted on 2015-10-13Two step method of rapid curing a semiconductor polymer layer
#31 | 2014-11-13 ✅ Patent 9,269,622 granted on 2016-02-23Semiconductor device and method of land grid array packaging with bussing lines
#32 | 2014-08-14PANELIZED PACKAGING WITH TRANSFERRED DIELECTRIC
#33 | 2014-07-22 ✅ Patent 8,784,621 granted on 2014-07-22Wafer carrier comprising a variable aperture shield
#34 | 2014-02-18 ✅ Patent 8,656,333 granted on 2014-02-18Integrated circuit package auto-routing
#35 | 2014-01-23 ✅ Patent 9,464,362 granted on 2016-10-11Magnetically sealed wafer plating jig system and method
#36 | 2014-01-09 ✅ Patent 8,922,021 granted on 2014-12-30Die up fully molded fan-out wafer level packaging
#37 | 2013-10-24 ✅ Patent 9,196,509 granted on 2015-11-24Semiconductor device and method of adaptive patterning for panelized packaging
#38 | 2013-09-26 ✅ Patent 8,826,221 granted on 2014-09-02Adaptive patterning for panelized packaging
#39 | 2013-09-26 ✅ Patent 8,932,443 granted on 2015-01-13Adjustable wafer plating shield and method
#40 | 2013-09-19 ✅ Patent 8,835,230 granted on 2014-09-16Fully molded fan-out
#41 | 2013-09-19 ✅ Patent 9,520,331 granted on 2016-12-13Adaptive patterning for panelized packaging
#42 | 2013-07-04 ✅ Patent 8,535,978 granted on 2013-09-17Die up fully molded fan-out wafer level packaging
#43 | 2013-07-04 ✅ Patent 8,604,600 granted on 2013-12-10Fully molded fan-out
#44 | 2013-06-27 ✅ Patent 9,418,905 granted on 2016-08-16Adaptive patterning for panelized packaging
#45 | 2011-12-22 ✅ Patent 9,653,339 granted on 2017-05-16Integrated shielding for wafer plating
#46 | 2011-08-18 ✅ Patent 8,799,845 granted on 2014-08-05Adaptive patterning for panelized packaging
Also check out Deca Technologies Inc.'s (Tempe, United States) applicant profile with 40 patent applications submitted.
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