Sungnam-Si
South Korea
10
2012-09-27
The entities that hold a legal rights for patent applications filed by inventor Ko WonJun:
WonJun Ko from Sungnam-Si, KR has applied for patents for these inventions. The list has both pending applications and granted patents:
Integrated circuit packaging system with collapsed multi-integration package and method of manufacture thereof
#2 | 2012-06-14Integrated circuit packaging system with dielectric support and method of manufacture thereof
#3 | 2012-06-14Integrated circuit packaging system with interposer
#4 | 2011-12-29Integrated circuit packaging system with trenches and method of manufacture thereof
#5 | 2010-09-30Integrated circuit packaging system with heat spreader and method of manufacture thereof
#6 | 2010-05-20Base package system for integrated circuit package stacking and method of manufacture thereof
#7 | 2009-10-01Integrated circuit package system with support structure under wire-in-film adhesive
#8 | 2009-07-30Integrated circuit package system with wafer scale heat slug
#9 | 2009-06-18Integrated circuit package system with package integration
#10 | 2009-03-26Integrated circuit packaging system with interposer
3189707 ⎘