Yu-Sin YANG

MULTILAYER STRUCTURE INSPECTION APPARATUS AND METHOD, AND SEMICONDUCTOR DEVICE FABRICATING METHOD USING THE INSPECTION METHOD

Methods for nondestructive measurements of thickness of underlying layers

Method of inspecting surface and method of manufacturing semiconductor device

Methods of manufacturing semiconductor device

Thickness prediction network learning method, semiconductor device manufacturing method, and semiconductor material deposition equipment

Inspecting apparatus based on hyperspectral imaging

Semiconductor pattern detecting apparatus

SUBSTRATE INSPECTION APPARATUS, METHOD OF CALIBRATING THE SUBSTRATE INSPECTION APPARATUS, AND METHOD OF FABRICATING SEMICONDUCTOR DEVICE USING THE SAME

METHOD OF INSPECTING SURFACE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

Method of inspecting semiconductor device

Apparatus for X-ray inspection, and a method for manufacturing a semiconductor device using the same

Optical measuring method for semiconductor wafer including a plurality of patterns and method of manufacturing semiconductor device using optical measurement

MONITORING APPARATUS AND SEMICONDUCTOR MANUFACTURING APPARATUS INCLUDING THE SAME

METHODS OF MANUFACTURING VERTICAL SEMICONDUCTOR DEVICES

METHODS OF INSPECTING DEFECT AND METHODS OF FABRICATING A SEMICONDUCTOR DEVICE USING THE SAME

Optical measuring method and apparatus, and method of manufacturing semiconductor device using the same

SEMICONDUCTOR DEVICE INSPECTION APPARATUS AND METHOD OF DRIVING THE SAME

Method of inspecting surface and method of manufacturing semiconductor device

Defect inspection method and defect inspection apparatus

Method of inspecting pattern defect

3D profiling system of semiconductor chip and method for operating the same

STRUCTURE ANALYSIS METHOD USING A SCANNING ELECTRON MICROSCOPE

Method of inspecting wafer using electron beam

Wafer Inspection Apparatus Using Three-Dimensional Image

METHOD AND SYSTEM FOR DETECTING DEFECTS

Apparatus for forming a thin layer and method of forming a thin layer on a substrate using the same

Image creating method and imaging system for performing the same

Surface inspecting method

Broadband light source and optical inspector having the same

APPARATUS OF INSPECTING RESISTIVE DEFECTS OF SEMICONDUCTOR DEVICES AND INSPECTING METHOD USING THE SAME

Apparatus for measuring thickness of thin film, system including the apparatus, and method for measuring thickness of thin film

Conductive atomic force microscope and method of operating the same

Apparatus and method for inspection of substrate defect

Spectral ellipsometry measurement and data analysis device and related systems and methods

Optical transformation module and optical measurement system, and method of manufacturing a semiconductor device using optical transformation module and optical measurement system

Overlay measuring method and system, and method of manufacturing semiconductor device using the same

PROCESS MANAGEMENT SYSTEMS USING COMPARISON OF STATISTICAL DATA TO PROCESS PARAMETERS AND PROCESS MANAGEMENT DEVICES

Scanning electron microscope system capable of measuring in-cell overlay offset using high-energy electron beam and method thereof

Method of detecting a defect of a substrate and apparatus for performing the same

Methods of fabricating microelectronic substrate inspection equipment

Method of inspecting wafer

Method and apparatus to measure step height of device using scanning electron microscope

SYSTEM AND METHOD FOR PROVIDING LIGHT

Reflector structure of illumination optic system

Microelectronic substrate inspection equipment using helium ion microscopy

Broadband light illuminators

Methods of generating three-dimensional process window qualification

Defect inspection apparatus and defect inspection method using the same

Apparatus and method to inspect defect of semiconductor device

Method for inspection of defects on a substrate

Apparatus and method to inspect defect of semiconductor device

Method of detecting a defect on an object

Apparatus and method for inspecting a surface of a wafer

Method of analyzing a wafer sample

APPARATUS AND METHOD FOR INSPECTING A WAFER

Method for detecting defects in a substrate having a semiconductor device thereon

Method of detecting defects in patterns on semiconductor substrate by comparing second image with reference image after acquiring second image from first image and apparatus for performing the same

Method of detecting defects of patterns on a semiconductor substrate and apparatus for performing the same

Wafer inspecting method

Method of measuring critical dimension

METHOD AND APPARATUS FOR CONTROLLING LIGHT INTENSITY AND FOR EXPOSING A SEMICONDUCTOR SUBSTRATE

Method of inspecgin a leakage current characteristic of a dielectric layer

Method of classifying defects

Method and apparatus for inspecting target defects on a wafer

Method of measuring a surface voltage of an insulating layer

Method of inspecting for defects and apparatus for performing the method

Method and apparatus for inspecting a substrate

Method and apparatus for inspecting defects in multiple regions with different parameters

Method and apparatus for inspecting substrate pattern

Method of inspecting a leakage current characteristic of a dielectric layer and apparatus for performing the method

Method of forming a three-dimensional image of a pattern to be inspected and apparatus for performing the same

Method and apparatus for measuring contamination of a semiconductor substrate

Chemical-mechanical polishing apparatus and method for controlling the same

Method and apparatus for inspecting defects

Method and apparatus for detecting contaminants in ion-implanted wafer

Method and apparatus for detecting a photolithography processing error, and method and apparatus for monitoring a photolithography process