Poughkeepsie, New York
United States
24
2012-07-05
The entities that hold a legal rights for patent applications filed by inventor LUNING Scott:
Scott LUNING from Poughkeepsie, US has applied for patents for these inventions. The list has both pending applications and granted patents:
STRAINED MOS DEVICE AND METHODS FOR ITS FABRICATION
#2 | 2011-11-03Semiconductor device with stressed fin sections
#3 | 2011-08-25METAL OXIDE SEMICONDUCTOR TRANSISTOR WITH REDUCED GATE HEIGHT, AND RELATED FABRICATION METHODS
#4 | 2011-04-14Semiconductor device with stressed fin sections, and related fabrication methods
#5 | 2011-03-17Embedded silicon germanium source drain structure with reduced silicide encroachment and contact resistance and enhanced channel mobility
#6 | 2011-02-03Methods for fabricating non-planar semiconductor devices having stress memory
#7 | 2011-02-03MOSFET with asymmetrical extension implant
#8 | 2011-01-27Methods for fabricating FinFET semiconductor devices using L-shaped spacers
#9 | 2010-12-09FINFET STRUCTURES WITH FINS HAVING STRESS-INDUCING CAPS AND METHODS FOR FABRICATING THE SAME
#10 | 2010-12-09FinFET structures with stress-inducing source/drain-forming spacers and methods for fabricating the same
#11 | 2010-03-11SEMICONDUCTOR TRANSISTOR DEVICE WITH IMPROVED ISOLATION ARRANGEMENT, AND RELATED FABRICATION METHODS
#12 | 2009-11-19MOSFET with asymmetrical extension implant
#13 | 2009-10-15Metal oxide semiconductor transistor with reduced gate height, and related fabrication methods
#14 | 2009-05-21Stressed field effect transistor and methods for its fabrication
#15 | 2008-10-30Stacking fault reduction in epitaxially grown silicon
#16 | 2008-10-23Methods for fabricating a stress enhanced semiconductor device having narrow pitch and wide pitch transistors
#17 | 2008-09-11STRESS ENHANCED MOS TRANSISTOR AND METHODS FOR ITS FABRICATION
#18 | 2008-04-03Stressed field effect transistor and methods for its fabrication
#19 | 2008-01-17Strained MOS device and methods for its fabrication
#20 | 2008-01-10Stacking fault reduction in epitaxially grown silicon
#21 | 2006-12-07Methods for manufacturing integrated circuits
#22 | 2006-01-05Method of forming an epitaxial layer for raised drain and source regions by removing surface defects of the initial crystal surface
#23 | 2005-12-06Integrated circuit and method for its manufacture
#24 | 2005-05-05Advanced technique for forming a transistor having raised drain and source regions
3209068 ⎘