Michael B. Cohn

City:

Berkeley, California

Country:

United States

Published Applications:

Last publication date:

2012-08-02

Top Assignees for applications by Michael B. Cohn

The entities that hold a legal rights for patent applications filed by inventor Cohn Michael B.:

Michael B. Cohn from Berkeley, US has applied for patents for these inventions. The list has both pending applications and granted patents:

MEMS device with integral packaging

High force MEMS device

MEMS device with integral packaging

Microelectromechanical systems using thermocompression bonding

MEMS device with integral packaging

MEMS device with integral packaging

Microelectromechanical systems using thermocompression bonding

InventorID:

3226342 ⎘