Kay Stephan Essig

City:

Leipzig

Country:

Germany

Published Applications:

Last publication date:

2012-09-20

Top Assignees for applications by Kay Stephan Essig

The entities that hold a legal rights for patent applications filed by inventor Essig Kay Stephan:

Kay Stephan Essig from Leipzig, DE has applied for patents for these inventions. The list has both pending applications and granted patents:

Semiconductor package with embedded die and manufacturing methods thereof

InventorID:

3257588 ⎘