North Plains, Oregon
United States
7
2012-11-08
The entities that hold a legal rights for patent applications filed by inventor Harmes Michael C.:
Michael C. Harmes from North Plains, US has applied for patents for these inventions. The list has both pending applications and granted patents:
Three-dimensional stacked substrate arrangements
#2 | 2011-10-27Three-dimensional stacked substrate arrangements
#3 | 2009-07-09Three-dimensional stacked substrate arrangements
#4 | 2007-01-18Method and structure for interfacing electronic devices
#5 | 2005-08-25Method and structure for interfacing electronic devices
#6 | 2005-03-22Method and structure for interfacing electronic devices
#7 | 2005-01-06Three-dimensional stacked substrate arrangements
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