Munich
Germany
9
2020-09-17
The entities that hold a legal rights for patent applications filed by inventor Seng Philipp:
Philipp Seng from Munich, DE has applied for patents for these inventions. The list has both pending applications and granted patents:
Electronic module comprising a semiconductor package with integrated clip and fastening element
#2 | 2018-01-11Semiconductor devices and methods for forming semiconductor devices
#3 | 2017-08-10Method for forming a semiconductor device and a semiconductor device
#4 | 2016-05-12Power semiconductor device with integrated temperature protection
#5 | 2016-04-21Insulated gate bipolar transistor comprising negative temperature coefficient thermistor
#6 | 2015-06-11Semiconductor diode
#7 | 2014-05-22Semiconductor device assembly including a chip carrier, semiconductor wafer and method of manufacturing a semiconductor device
#8 | 2013-07-11Semiconductor diode and method for forming a semiconductor diode
#9 | 2005-12-06Lateral PIN diode and method for processing same
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