Michael E. Johnson

City:

Tempe, Arizona

Country:

United States

Published Applications:

Last publication date:

2011-01-06

Top Assignees for applications by Michael E. Johnson

The entities that hold a legal rights for patent applications filed by inventor Johnson Michael E.:

Michael E. Johnson from Tempe, US has applied for patents for these inventions. The list has both pending applications and granted patents:

METHODS AND STRUCTURES FOR A VERTICAL PILLAR INTERCONNECT

Solder Bump/Under Bump Metallurgy Structure for High Temperature Applications

Wafer-level moat structures

Forming partial-depth features in polymer film

InventorID:

3326968 ⎘