Kaushik Chanda

System involving electrically reprogrammable fuses

Methods and systems involving electrically reprogrammable fuses

E-fuse structures and methods of manufacture

Stacked via structure for metal fuse applications

Metal cap for back end of line (BEOL) interconnects, design structure and method of manufacture

Method of manufacturing an interconnect structure and design structure thereof

Method for fabricating air gap interconnect structures

Interconnect structure with enhanced reliability

Electrically programmable fuse and fabrication method

Methods and systems involving electrically reprogrammable fuses

Reliability of wide interconnects

Interconnect structures, design structure and method of manufacture

Electrically programmable fuse and fabrication method

Stress locking layer for reliable metallization

Interconnect structure for integrated circuits having improved electromigration characteristics

Structure and method of forming electrically blown metal fuses for integrated circuits

Methodology for Thermal Modeling of On-Chip Interconnects Based on Electromagnetic Simulation Tools

Test structure for determining optimal seed and liner layer thicknesses for dual damascene processing

Test structure for electromigration analysis and related method

INTERCONNECT STRUCTURE WITH IMPROVED ELECTROMIGRATION RESISTANCE AND METHOD OF FABRICATING SAME

METHODS AND SYSTEMS INVOLVING ELECTRICALLY REPROGRAMMABLE FUSES

Test structure for electromigration analysis and related method

Non-Destructive Electrical Characterization Macro and Methodology for In-Line Interconnect Spacing Monitoring

Semiconductor wiring structures including dielectric cap within metal cap layer

Structure for modeling stress-induced degradation of conductive interconnects

Interconnect structure with bi-layer metal cap

Method for prediction of premature dielectric breakdown in a semiconductor

Addressable hierarchical metal wire test methodology

Structure for monitoring stress-induced degradation of conductive interconnects

Metal resistor and resistor material

Metal resistor, resistor material and method

Post chemical mechanical polishing etch for improved time dependent dielectric breakdown reliability

INTERCONNECT METALLIZATION PROCESS WITH 100% OR GREATER STEP COVERAGE

Method to improve time dependent dielectric breakdown

Structure and method for monitoring stress-induced degradation of conductive interconnects

Method of forming an interconnect including a dielectric cap having a tensile stress

VIA bottom contact and method of manufacturing same

METHOD FOR PREDICTION OF PREMATURE DIELECTRIC BREAKDOWN IN A SEMICONDUCTOR

Method of forming interconnect structure or interconnect and via structures using post chemical mechanical polishing

NANOSCALE DEFECT IMAGE DETECTION FOR SEMICONDUCTORS