Dietmar Send

City:

Durach

Country:

Germany

Published Applications:

Last publication date:

2011-02-03

Top Assignees for applications by Dietmar Send

The entities that hold a legal rights for patent applications filed by inventor Send Dietmar:

Dietmar Send from Durach, DE has applied for patents for these inventions. The list has both pending applications and granted patents:

PACKAGING WITH A SUBSEQUENTLY MOLDED FORM-FIT CONNECTION

Film dereeler with a disk brake

PACKAGING WITH SUBSEQUENTLY MOLDED FORM-FIT CONNECTION

Machine for making packaging with form-fit connection

Device for positioning a web of film of a packaging device

InventorID:

3335941 ⎘