Tokyo
Japan
40
2026-03-12
The entities that hold a legal rights for patent applications filed by inventor Watanabe Yosuke:
Yosuke Watanabe from Tokyo, JP has applied for patents for these inventions. The list has both pending applications and granted patents:
VAPOR CHAMBER
#2 | 2026-02-12SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
#3 | 2025-12-18ANTIBODY VARIANT AND ISOFORM WITH LOWERED BIOLOGICAL ACTIVITY
#4 | 2025-09-18SEMICONDUCTOR DEVICE
#5 | 2025-04-10FILTER CIRCUIT
#6 | 2025-03-20RIGHT ANGLE TYPE CONNECTOR AND NOISE REDUCTION PART
#7 | 2025-03-13HEAT SINK
#8 | 2024-12-12HEAT TRANSPORT DEVICE
#9 | 2024-08-01Heat sink
#10 | 2023-12-21HEAT SINK
#11 | 2023-08-24VAPOR CHAMBER
#12 | 2023-03-23NOISE SUPPRESSION TAPE
#13 | 2022-03-24CONNECTOR
#14 | 2022-02-10Noise reduction element
#15 | 2021-11-18Feature identification device, feature identification method, and computer readable medium
#16 | 2021-02-04Entry field extraction device and computer readable medium
#17 | 2021-01-07Heatsink
#18 | 2020-12-24Heat pipe heatsink with internal structural support plate
#19 | 2020-12-24Heatsink
#20 | 2020-12-17Heatsink
#21 | 2020-09-10ANTIBODY VARIANT AND ISOFORM WITH LOWERED BIOLOGICAL ACTIVITY
#22 | 2020-06-04Heat sink
#23 | 2020-06-04Heat sink
#24 | 2019-08-01METHOD FOR INTRODUCING SUBSTANCE INTO PLANT CELL USING PLASMA
#25 | 2019-02-28Semiconductor device, power-supply system, and controlling method of semiconductor device
#26 | 2013-07-11Frequent pattern extraction apparatus frequent pattern extraction method and program
#27 | 2012-12-06Cable coupling connector
#28 | 2011-01-13Stable formulations of thiadiazole derivative
#29 | 2009-11-26Wafer laser processing method and apparatus
#30 | 2009-02-17Folding electric device having perpendicular and horizontal shafts
#31 | 2008-03-06Wafer laser processing method
#32 | 2008-02-26Wiring structure for folding portable device
#33 | 2008-01-31Method of forming embrittled areas inside wafer for division
#34 | 2007-10-18Laser beam processing machine
#35 | 2007-07-19Wafer dividing method and wafer dividing apparatus
#36 | 2006-10-19Fold-type data processing apparatus having a hinge
#37 | 2006-08-29Fold-type data processing apparatus having a hinge
#38 | 2006-04-13Wafer grinding method
#39 | 2006-04-13Silicon wafer laser processing method and laser beam processing machine
#40 | 2006-04-13Laser beam processing machine
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