Teck Sim Lee

City:

Malacca

Country:

Malaysia

Published Applications:

Last publication date:

2011-05-26

Top Assignees for applications by Teck Sim Lee

The entities that hold a legal rights for patent applications filed by inventor Lee Teck Sim:

Teck Sim Lee from Malacca, MY has applied for patents for these inventions. The list has both pending applications and granted patents:

Semiconductor device with protruding component portion and method of packaging

Method of fabricating a semiconductor package with mold lock opening

Semiconductor package with mold lock vent

Semiconductor device

InventorID:

3389942 ⎘