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Inventor profile of:

Daisuke Hayashi

City:

Nirasaki

Country:

Japan

Published Applications:

Last publication date:

2013-07-04

Top Assignees for applications by Daisuke Hayashi

The entities that hold a legal rights for patent applications filed by inventor Hayashi Daisuke:

TOKYO ELECTRON LIMITED 26 Tokyo, Japan
TOKYO ELECTRON LIMITED 5 Minato-ku, Japan
NIPPON VALQUA INDUSTRIES, LTD. 1 Shinjuku-ku, Japan
TOKYO ELECTRON LIMITED 1 Tokyo-To, Japan
NIPPON VALQUA INDUSTRIES, LTD. 1 Tokyo, Japan

Recent patent applications by Hayashi Daisuke

Daisuke Hayashi from Nirasaki, JP has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2013-07-04

US20130168369A1

Electricity

Cooling block forming electrode

#2 | 2011-09-22

US20110226420A1

Electricity

Electrode and plasma processing apparatus

#3 | 2011-08-04

US20110186229A1

Performing operations; transporting

Gas shower structure and substrate processing apparatus

#4 | 2011-07-07

US20110162799A1

Electricity

Plasma processing apparatus and electrode used therein

#5 | 2011-06-30

US20110155322A1

Electricity

Plasma processing apparatus

#6 | 2011-01-06

US20110000894A1

Electricity

Cooling block forming electrode

#7 | 2010-12-02

US20100304505A1

Electricity

Processing method for recovering a damaged low-k film of a substrate and storage medium

#8 | 2010-09-30

US20100243167A1

Electricity

Substrate processing apparatus

#9 | 2010-09-30

US20100243166A1

Electricity

Gas flow path structure and substrate processing apparatus

#10 | 2010-09-09

US20100224325A1

Electricity

Plasma processing apparatus and electrode for same

#11 | 2010-06-10

US20100140085A1

Electricity

Magnetron plasma processing apparatus

#12 | 2010-03-16

US10468108

Focus ring for semiconductor treatment and plasma treatment device

#13 | 2010-02-25

US20100043975A1

Electricity

Movable gas introduction structure and substrate processing apparatus having same

#14 | 2008-09-04

US20080210680A1

Electricity

Substrate processing apparatus

#15 | 2008-07-31

US20080182423A1

Electricity

Substrate processing apparatus and gas supply method

#16 | 2008-07-31

US20080181825A1

Electricity

Substrate mounting structure and substrate processing apparatus

#17 | 2008-07-31

US20080178914A1

Chemistry; metallurgy

Substrate processing apparatus

#18 | 2008-06-26

US20080149598A1

Electricity

Substrate processing apparatus, focus ring heating method, and substrate processing method

#19 | 2008-05-01

US20080099440A1

Electricity

Substrate processing method and substrate processing system

#20 | 2007-07-26

US20070170156A1

Electricity

Electrode for generating plasma and plasma processing apparatus using same

#21 | 2007-07-26

US20070169891A1

Electricity

Focus ring and plasma processing apparatus

#22 | 2007-04-05

US20070075503A1

Mechanical engineering

Sealing part and substrate processing apparatus

#23 | 2006-08-17

US20060180074A1

Electricity

Plasma processing apparatus and components thereof, and method for detecting life span of the components

#24 | 2005-09-29

US20050211384A1

Chemistry; metallurgy

Thermally sprayed member, electrode and plasma processing apparatus using the electrode

#25 | 2005-05-19

US20050103440A1

Electricity

Magnetron plasma processing apparatus

#26 | 2005-02-03

US20050023254A1

Electricity

Plasma processing apparatus, electrode unit, feeder member and radio frequency feeder rod

#27 | 2005-01-20

US20050011456A1

Electricity

Processing apparatus and gas discharge suppressing member

InventorID:

3424679 ⎘