Junwei Hu

City:

Shanghai

Country:

China

Published Applications:

Last publication date:

2021-08-12

Top Assignees for applications by Junwei Hu

The entities that hold a legal rights for patent applications filed by inventor Hu Junwei:

Junwei Hu from Shanghai, CN has applied for patents for these inventions. The list has both pending applications and granted patents:

Temperature compensation circuit and phased array apparatus

Method of forming perforated opening in bottom substrate of flipchip pop assembly to reduce bleeding of underfill material

InventorID:

3475414 ⎘