Jun Watanabe

City:

Shibukawa

Country:

Japan

Published Applications:

Last publication date:

2016-02-04

Top Assignees for applications by Jun Watanabe

The entities that hold a legal rights for patent applications filed by inventor Watanabe Jun:

DENKI KAGAKU KOGYO KABUSHIKI KAISHA 6 Tokyo, Japan
Kabushiki Kaisha Toshiba 2 Tokyo, Japan
TOKYO ELECTRON LIMITED 2 Tokyo, Japan
DENKI KAGAKU KOGYO KABUSHIKI KAISHA 1 Chuo-ku, Tokyo, Japan
Denka Company Limited 1 Tokyo, Japan
Toshiba Memory Corporation 1 Tokyo, Japan

Recent patent applications by Watanabe Jun

Jun Watanabe from Shibukawa, JP has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2016-02-04

US20160035543A1

Electricity

Plasma processing apparatus

#2 | 2015-07-09

US20150190851A1

Performing operations; transporting

Reticle chuck cleaner

#3 | 2013-04-18

US20130092326A1

Performing operations; transporting

Method for separating bonded bodies using excimer light irradiation

#4 | 2012-08-16

US20120205043A1

Chemistry; metallurgy

(Meth)acrylic resin composition

#5 | 2012-03-22

US20120070660A1

Chemistry; metallurgy

Curable resin composition, adhesive composition, cured object or composite

#6 | 2012-02-02

US20120024318A1

Performing operations; transporting

Reticle chuck cleaner

#7 | 2011-12-29

US20110315318A1

Electricity

Focus ring and manufacturing method therefor

#8 | 2011-06-02

US20110128023A1

Physics

Probe inspecting method and curable resin composition

#9 | 2011-04-14

US20110086973A1

Chemistry; metallurgy

Curable composition

#10 | 2009-01-29

US20090030107A1

Chemistry; metallurgy

Energy ray-curable resin composition and adhesive using same

InventorID:

3497759 ⎘