Chung-Che Dan

City:

Hsinchu

Country:

Taiwan

Published Applications:

Last publication date:

2023-10-26

Top Assignees for applications by Chung-Che Dan

The entities that hold a legal rights for patent applications filed by inventor Dan Chung-Che:

Chung-Che Dan from Hsinchu, TW has applied for patents for these inventions. The list has both pending applications and granted patents:

PIXEL PACKAGE

Chip-type light emitting device having precisely coated wavelength-converting layer and packaged structure thereof

Wafer-type light emitting device having precisely coated wavelength-converting layer

InventorID:

3498294 ⎘