Chu-Nan
Taiwan
75
2025-05-01
66
2025-01-07
These are the the leading inventors for applications assigned to SEMILEDS OPTOELECTRONICS CO., LTD.:
SEMILEDS OPTOELECTRONICS CO., LTD. based in Chu-Nan, TW has been assigned the rights to these inventions. The list includes both Pending Applications and Patent Grants:
METHOD FOR MAKING ELECTRONIC DEVICE ARRAYS USING A TEMPORARY SUBSTRATE
#2 | 2024-02-01 ✅ Patent 12,191,434 granted on 2025-01-07Method for making electronic device arrays using a temporary substrate
#3 | 2023-12-21 ✅ Patent 12,206,051 granted on 2025-01-21Light emitting diode (LED) structure having single epitaxial structure separated into light emitting zones
#4 | 2022-11-03 ✅ Patent 12,364,079 granted on 2025-07-15Method For Making Light Emitting Device (LED) Arrays And Electronic Products Using A Temporary Substrate And A Carrier Substrate
#5 | 2022-09-01 ✅ Patent 11,817,536 granted on 2023-11-14Method for making electronic device arrays using a temporary substrate and a carrier substrate
#6 | 2021-04-22 ✅ Patent 11,728,461 granted on 2023-08-15Single light emitting diode (LED) structure having epitaxial structure separated into light emitting zones
#7 | 2021-02-11 ✅ Patent 11,387,397 granted on 2022-07-12Method for making light emitting device (LED) arrays using a temporary substrate and a carrier substrate
#8 | 2019-05-30 ✅ Patent 10,910,535 granted on 2021-02-02Method for making light emitting device LED arrays
#9 | 2019-02-28 ✅ Patent 10,964,851 granted on 2021-03-30Single light emitting diode (LED) structure
#10 | 2017-01-19 ✅ Patent 9,653,435 granted on 2017-05-16Light emitting diode (LED) package having short circuit (VLED) die, lens support dam and same side electrodes and method of fabrication
#11 | 2016-08-04 ✅ Patent 9,537,073 granted on 2017-01-03Method for fabricating a light emitting diode (LED) die having strap layer
#12 | 2016-06-23 ✅ Patent 9,437,794 granted on 2016-09-06Method of fabricating a flip chip light emitting diode (FCLED) die having N-conductor layer
#13 | 2016-01-28 ✅ Patent 9,419,195 granted on 2016-08-16Light emitting diode (LED) die having strap layer and method of fabrication
#14 | 2015-10-01WHITE FLIP CHIP LIGHT EMITTING DIODE (FC LED) AND FABRICATION METHOD
#15 | 2015-06-04 ✅ Patent 9,343,639 granted on 2016-05-17Light emitting diode (LED) device having lens protective structure and method of fabrication
#16 | 2015-03-12 ✅ Patent 9,312,455 granted on 2016-04-12Method for fabricating light emitting diode (LED) dice with wavelength conversion layers
#17 | 2014-11-20 ✅ Patent 9,130,114 granted on 2015-09-08Vertical light emitting diode (VLED) dice having confinement layers with roughened surfaces and methods of fabrication
#18 | 2014-07-15 ✅ Patent 8,778,780 granted on 2014-07-15Method for defining semiconductor devices
#19 | 2014-06-05 ✅ Patent 8,871,547 granted on 2014-10-28Method for fabricating vertical light emitting diode (VLED) structure using a laser pulse to remove a carrier substrate
#20 | 2014-06-05 ✅ Patent 9,343,620 granted on 2016-05-17Method for fabricating a light emitting diode (LED) die having protective substrate
#21 | 2014-03-27 ✅ Patent 8,802,465 granted on 2014-08-12Method for handling a semiconductor wafer assembly
#22 | 2014-03-13 ✅ Patent 9,231,152 granted on 2016-01-05Light emitting diode
#23 | 2014-03-06 ✅ Patent 9,190,589 granted on 2015-11-17Light emitting diode
#24 | 2014-02-20METHOD FOR FABRICATING A VERTICAL LIGHT EMITTING DIODE (VLED) DIE HAVING EPITAXIAL STRUCTURE WITH PROTECTIVE LAYER
#25 | 2014-02-20METHOD FOR FABRICATING LIGHT EMITTING DIODE (LED) DICE USING BOND PAD DAM AND WAVELENGTH CONVERSION LAYERS
#26 | 2013-12-19 ✅ Patent 8,716,041 granted on 2014-05-06Method for fabricating side by side light emitting diode (LED) having separate electrical and heat transfer paths
#27 | 2013-12-19 ✅ Patent 8,703,515 granted on 2014-04-22Method for guiding current in a light emitting diode (LED) device
#28 | 2013-11-14 ✅ Patent 8,921,204 granted on 2014-12-30Method for fabricating semiconductor dice by separating a substrate from semiconductor structures using multiple laser pulses
#29 | 2013-10-03 ✅ Patent 8,722,433 granted on 2014-05-13Method for fabricating light emitting diode (LED) dice with wavelength conversion layers
#30 | 2013-09-26 ✅ Patent 8,759,128 granted on 2014-06-24Light emitting diode (LED) die having recessed electrode and light extraction structures and method of fabrication
#31 | 2013-03-21OPTOELECTRONIC DEVICE HAVING CONDUCTIVE SUBSTRATE
#32 | 2013-03-14 ✅ Patent 8,841,146 granted on 2014-09-23Method and system for fabricating light emitting diode (LED) dice with wavelength conversion layers having controlled color characteristics
#33 | 2013-03-14 ✅ Patent 8,912,021 granted on 2014-12-16System and method for fabricating light emitting diode (LED) dice with wavelength conversion layers
#34 | 2013-03-14 ✅ Patent 8,410,508 granted on 2013-04-02Light emitting diode (LED) package having wavelength conversion member and wafer level fabrication method
#35 | 2013-03-14 ✅ Patent 8,492,746 granted on 2013-07-23Light emitting diode (LED) dice having wavelength conversion layers
#36 | 2013-03-07LIGHT EMITTING DIODE (LED) SYSTEM HAVING APPLICATION SPECIFIC INTEGRATED CIRCUIT (ASIC) AND WIRELESS SYSTEM
#37 | 2013-03-07 ✅ Patent 9,214,456 granted on 2015-12-15Light emitting diode (LED) system having lighting device and wireless control system
#38 | 2013-01-31 ✅ Patent 8,723,160 granted on 2014-05-13Light emitting diode (LED) die having peripheral electrode frame and method of fabrication
#39 | 2013-01-03OPTOELECTRONIC DEVICE HAVING CURRENT BLOCKING INSULATION LAYER FOR UNIFORM TEMPERATURE DISTRIBUTION AND METHOD OF FABRICATION
#40 | 2012-12-04 ✅ Patent 8,324,082 granted on 2012-12-04Method for fabricating conductive substrates for electronic and optoelectronic devices
#41 | 2012-07-05 ✅ Patent 8,686,461 granted on 2014-04-01Light emitting diode (LED) die having stepped substrates and method of fabrication
#42 | 2012-06-14 ✅ Patent 8,546,818 granted on 2013-10-01Vertical LED with current-guiding structure
#43 | 2012-05-10 ✅ Patent 8,642,421 granted on 2014-02-04Light-emitting diode device structure with SiNlayer
#44 | 2012-04-19 ✅ Patent 8,933,467 granted on 2015-01-13Smart integrated semiconductor light emitting system including nitride based light emitting diodes (LED) and application specific integrated circuits (ASIC)
#45 | 2012-04-12LED Device With A Light Extracting Rough Structure And Manufacturing Methods Thereof
#46 | 2012-03-06 ✅ Patent 8,129,237 granted on 2012-03-06Vertical light-emitting diode device structure with SiNlayer
#47 | 2012-02-28 ✅ Patent 8,124,454 granted on 2012-02-28Die separation
#48 | 2012-02-02 ✅ Patent 8,283,652 granted on 2012-10-09Vertical light emitting diode (VLED) die having electrode frame and method of fabrication
#49 | 2011-12-29 ✅ Patent 8,552,458 granted on 2013-10-08Side by side light emitting diode (LED) having separate electrical and heat transfer paths
#50 | 2011-12-29 ✅ Patent 8,614,453 granted on 2013-12-24Chip-type light emitting device having precisely coated wavelength-converting layer and packaged structure thereof
#51 | 2011-11-24 ✅ Patent 8,552,451 granted on 2013-10-08Light-emitting diode with increased light extraction
#52 | 2011-09-08 ✅ Patent 8,802,469 granted on 2014-08-12Method of fabricating semiconductor die using handling layer
#53 | 2011-05-19 ✅ Patent 8,450,758 granted on 2013-05-28Light emitting diode device
#54 | 2011-03-03 ✅ Patent 8,101,966 granted on 2012-01-24Light-emitting diode lamp with low thermal resistance
#55 | 2010-12-14 ✅ Patent 7,852,015 granted on 2010-12-14Solid state lighting system and maintenance method therein
#56 | 2010-11-11LED DEVICE WITH A LIGHT EXTRACTING ROUGH STRUCTURE AND MANUFACTURING METHODS THEREOF
#57 | 2010-10-21 ✅ Patent 8,319,252 granted on 2012-11-27Light emitting device with high color rendering index and high luminescence efficiency
#58 | 2010-10-14 ✅ Patent 8,003,994 granted on 2011-08-23Vertical LED with current guiding structure
#59 | 2010-05-25 ✅ Patent 7,723,718 granted on 2010-05-25Epitaxial structure for metal devices
#60 | 2010-03-30 ✅ Patent 7,687,322 granted on 2010-03-30Method for removing semiconductor street material
#61 | 2009-09-24 ✅ Patent 8,716,848 granted on 2014-05-06LED device with conductive wings and tabs
#62 | 2009-04-09 ✅ Patent 7,968,379 granted on 2011-06-28Method of separating semiconductor dies
#63 | 2009-03-12 ✅ Patent 8,866,185 granted on 2014-10-21White light LED with multiple encapsulation layers
#64 | 2008-12-18 ✅ Patent 7,759,670 granted on 2010-07-20Vertical LED with current guiding structure
#65 | 2008-11-06 ✅ Patent 7,759,146 granted on 2010-07-20Method of making high efficiency UV VLED on metal substrate
#66 | 2008-08-28 ✅ Patent 7,781,783 granted on 2010-08-24White light LED device
#67 | 2008-08-14 ✅ Patent 7,892,891 granted on 2011-02-22Die separation
#68 | 2008-07-17 ✅ Patent 7,811,842 granted on 2010-10-12LED array
#69 | 2008-06-19 ✅ Patent 7,897,420 granted on 2011-03-01Light emitting diodes (LEDs) with improved light extraction by roughening
#70 | 2008-05-01 ✅ Patent 7,781,247 granted on 2010-08-24Method for producing Group III-Group V vertical light-emitting diodes
#71 | 2008-02-07 ✅ Patent 7,829,440 granted on 2010-11-09Method of separating semiconductor dies
#72 | 2007-12-06 ✅ Patent 7,615,789 granted on 2009-11-10Vertical light emitting diode device structure
#73 | 2007-10-18 ✅ Patent 7,863,639 granted on 2011-01-04Light-emitting diode lamp with low thermal resistance
#74 | 2007-07-19 ✅ Patent 7,563,625 granted on 2009-07-21Method of making light-emitting diodes (LEDs) with improved light extraction by roughening
#75 | 2007-01-04 ✅ Patent 8,012,774 granted on 2011-09-06Coating process for a light-emitting diode (LED)
Also check out SemiLEDs Optoelectronics Co., Ltd's (Chu-nan, Taiwan) applicant profile with 20 patent applications submitted.
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