Cary, North Carolina
United States
8
2011-08-09
The entities that hold a legal rights for patent applications filed by inventor Mis J. Daniel:
J. Daniel Mis from Cary, US has applied for patents for these inventions. The list has both pending applications and granted patents:
Lead free alloy bump structure and fabrication method
#2 | 2011-02-17Electronic structures including barrier layers and/or oxidation barriers defining lips and related methods
#3 | 2010-02-23Electronic devices including metallurgy structures for wire and solder bonding
#4 | 2009-08-27Solder structures including barrier layers with nickel and/or copper
#5 | 2008-12-18Electronic structures including barrier layers defining lips
#6 | 2006-02-09Methods of forming lead free solder bumps
#7 | 2005-11-03Methods of forming solder bumps on exposed metal pads
#8 | 2005-09-29Methods of forming bumps using barrier layers as etch masks
3517181 ⎘