Reichenbach
Germany
9
2025-12-25
The entities that hold a legal rights for patent applications filed by inventor Schindler Uwe:
Uwe Schindler from Reichenbach, DE has applied for patents for these inventions. The list has both pending applications and granted patents:
SEMICONDUCTOR DEVICE INCLUDING A COINED DIEPAD
#2 | 2025-02-13Leadframe, Encapsulated Package with Punched Lead and Sawn Side Flanks, and Corresponding Manufacturing Method
#3 | 2025-01-30PACKAGE WITH RECESS FOR BALANCING CREEPAGE CURRENT PATHS
#4 | 2024-05-16POWER SEMICONDUCTOR PACKAGE AND METHOD FOR FABRICATING THE SAME
#5 | 2023-02-02Semiconductor Device Module Comprising Flexible Leads for the Purpose of Height Adjustment
#6 | 2021-07-22Leadframe, encapsulated package with punched lead and sawn side flanks, and corresponding manufacturing method
#7 | 2011-06-02GMR sensor within molded magnetic material employing non-magnetic spacer
#8 | 2008-07-03Connector module and method of manufacturing the same
#9 | 2007-06-28Integrated magnetic sensor component
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