Villach
Austria
31
2025-05-15
The entities that hold a legal rights for patent applications filed by inventor Roesner Michael:
Michael Roesner from Villach, AT has applied for patents for these inventions. The list has both pending applications and granted patents:
COMPONENT AND METHOD OF MANUFACTURING A COMPONENT USING AN ULTRATHIN CARRIER
#2 | 2023-10-05SEMICONDUCTOR DEVICE WITH METAL SILICIDE LAYER
#3 | 2022-08-04Component and Method of Manufacturing a Component Using an Ultrathin Carrier
#4 | 2019-12-19Methods of forming a silicon-insulator layer and semiconductor device having the same
#5 | 2019-11-21Semiconductor devices including a metal silicide layer and methods for manufacturing thereof
#6 | 2019-10-10Method of processing a silicon carbide containing crystalline substrate, silicon carbide chip, and processing chamber
#7 | 2019-09-26Silicon carbide devices and methods for manufacturing the same
#8 | 2019-05-16Component and method of manufacturing a component using an ultrathin carrier
#9 | 2019-03-28Magnetic phase change material for heat dissipation
#10 | 2018-11-01Integrated circuit substrate and method for manufacturing the same
#11 | 2018-01-04Segmented edge protection shield
#12 | 2017-12-14Plasma dicing of silicon carbide
#13 | 2017-07-20Method of processing a porous conductive structure in connection to an electronic component on a substrate
#14 | 2017-06-08Method for simultaneous structuring and chip singulation
#15 | 2017-03-16Methods for processing a semiconductor workpiece
#16 | 2016-12-29Method of dicing a wafer
#17 | 2016-11-24Segmented edge protection shield
#18 | 2016-11-15Semiconductor chip with structured sidewalls
#19 | 2016-11-03Integrated circuit substrate and method for manufacturing the same
#20 | 2016-09-08Source down semiconductor devices and methods of formation thereof
#21 | 2016-07-14Embrittlement device, pick-up system and method of picking up chips
#22 | 2016-05-19Method for processing a semiconductor substrate and a method for processing a semiconductor wafer
#23 | 2016-02-04Source down semiconductor devices and methods of formation thereof
#24 | 2016-02-04Carrier system for processing semiconductor substrates, and methods thereof
#25 | 2015-10-01Kerf preparation for backside metallization
#26 | 2015-08-06Method for simultaneous structuring and chip singulation
#27 | 2015-07-23Singulation of semiconductor dies with contact metallization by electrical discharge machining
#28 | 2015-05-28METHODS FOR PROCESSING A SEMICONDUCTOR WORKPIECE
#29 | 2015-03-05Methods for processing a semiconductor wafer
#30 | 2014-01-09Component and method of manufacturing a component using an ultrathin carrier
#31 | 2013-07-25Methods of forming semiconductor devices
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