Deenesh Padhi

SUBSTRATE DEFECT ANALYSIS BASED ON MULTIPLE DATA TYPES

HEATER MATERIALS TO PREVENT ARCING

DEPOSITION FILM TUNING AND TEMPERATURE TUNING FOR ETCH UNIFORMITY

SHAPED SHOWERHEAD FOR EDGE PLASMA MODULATION

MODIFIED STACKS FOR 3D NAND

SHAPED FACEPLATE FOR EXTREME EDGE FILM UNIFORMITY

SUBSTRATE STRESS UNIFORMITY MANAGEMENT BASED ON OVERLAY ERROR MEASUREMENTS

PECVD OF SIBN THIN FILMS WITH LOW LEAKAGE CURRENT

ANALYZING IN-PLANE DISTORTION

SEMICONDUCTOR CLEANING USING PLASMA-FREE PRECURSORS

FLUORINE-DOPED SILICON-CONTAINING MATERIALS

CARBON MOLD FOR DRAM CAPACITOR

Profile shaping for control gate recesses

SYSTEMS AND METHODS OF SEASONING ELECTROSTATIC CHUCKS WITH DIELECTRIC SEASONING FILMS

Analyzing in-plane distortion

HYDROPHOBIC AND ICEPHOBIC COATING

SHAPED SHOWERHEAD FOR EDGE PLASMA MODULATION

MESA HEIGHT MODULATION FOR THICKNESS CORRECTION

Methods Of Forming Memory Device With Reduced Resistivity

Boron nitride for mask patterning

Low impedance current path for edge non-uniformity tuning

Helium-free silicon formation

DOPED SILICON NITRIDE FOR 3D NAND

SILICON OXIDE GAP FILL USING CAPACITIVELY COUPLED PLASMAS

Analyzing in-plane distortion

Tensile nitride deposition systems and methods

Profile shaping for control gate recesses

Systems and methods of seasoning electrostatic chucks with dielectric seasoning films

ELECTRIC ARC MITIGATING FACEPLATE

METHOD OF REDUCING DEFECTS IN A MULTI-LAYER PECVD TEOS OXIDE FILM

Power supply signal conditioning for an electrostatic chuck

Deposition of silicon boron nitride films

Systems and methods for depositing high density and high tensile stress films

Systems and methods for depositing low-k dielectric films

Methods for pressure ramped plasma purge

Multi zone electrostatic chuck

Initiation modulation for plasma deposition

SURFACE ENCASING MATERIAL LAYER

REPULSION MESH AND DEPOSITION METHODS

CHAMBER CONFIGURATIONS FOR CONTROLLED DEPOSITION

Modified stacks for 3D NAND

Semiconductor substrate supports with improved high temperature chucking

Low-k dielectric with self-forming barrier layer

Method for forming a hydrophobic and icephobic coating

Multi-layer stacks for 3D NAND extendability

Multi channel splitter spool

Method of forming film stacks with reduced defects

METHODS FOR FORMING FILMS CONTAINING SILICON BORON WITH LOW LEAKAGE CURRENT

METHODS FOR DEPOSITING PHOSPHORUS-DOPED SILICON NITRIDE FILMS

Film stack overlay improvement

LOW DIELECTRIC CONSTANT OXIDE AND LOW RESISTANCE OP STACK FOR 3D NAND APPLICATION

Method to enable high temperature processing without chamber drifting

NON-UV HIGH HARDNESS LOW K FILM DEPOSITION

On stack overlay improvement for 3D NAND

Pulsed plasma deposition etch step coverage improvement

SiBN film for conformal hermetic dielectric encapsulation without direct RF exposure to underlying structure material

Dry etch rate reduction of silicon nitride films

Shadow ring for modifying wafer edge and bevel deposition

Multi-layer stacks for 3D NAND extendibility

Oxide with higher utilization and lower cost

Methods for depositing dielectric barrier layers and aluminum containing etch stop layers

Method of depositing doped amorphous silicon films with enhanced defect control, reduced substrate sensitivity to in-film defects and bubble-free film growth

Low dielectric constant oxide and low resistance OP stack for 3D NAND application

Selective poreseal deposition prevention and residue removal using SAM

High deposition rate and high quality nitride

Borane mediated dehydrogenation process from silane and alkylsilane species for spacer and hardmask application

Method and system for high temperature clean

Ultra-conformal carbon film deposition

Conformal strippable carbon film for line-edge-roughness reduction for advanced patterning

Conformal amorphous carbon for spacer and spacer protection applications

METHOD AND APPARATUS FOR CLAMPING AND DECLAMPING SUBSTRATES USING ELECTROSTATIC CHUCKS

LOW TEMP SINGLE PRECURSOR ARC HARD MASK FOR MULTILAYER PATTERNING APPLICATION

Methods for depositing dielectric barrier layers and aluminum containing etch stop layers

Interconnect integration for sidewall pore seal and via cleanliness

Conformal strippable carbon film for line-edge-roughness reduction for advanced patterning

Inhibitor plasma mediated atomic layer deposition for seamless feature fill

Aluminum nitride barrier layer

Interconnect structures and methods of formation

Ultra-thin dielectric diffusion barrier and etch stop layer for advanced interconnect applications

SELECTIVE SEALANT REMOVAL

UV assisted CVD AlN film for BEOL etch stop application

NITROGEN DOPED AMORPHOUS CARBON HARDMASK

Enhancing electrical property and UV compatibility of ultrathin blok barrier film

Method for selectively sealing ultra low-k porous dielectric layer using flowable dielectric film formed from vapor phase dielectric precursor

Method for critical dimension reduction using conformal carbon films

Ultra-conformal carbon film deposition

Conformal amorphous carbon for spacer and spacer protection applications

Inhibitor plasma mediated atomic layer deposition for seamless feature fill

METHODS AND APPARATUS FOR FORMING FLOWABLE DIELECTRIC FILMS HAVING LOW POROSITY

NITROGEN DOPED AMORPHOUS CARBON HARDMASK

CONFORMAL AMORPHOUS CARBON FOR SPACER AND SPACER PROTECTION APPLICATIONS

CONFORMAL SACRIFICIAL FILM BY LOW TEMPERATURE CHEMICAL VAPOR DEPOSITION TECHNIQUE

Ultra high selectivity doped amorphous carbon strippable hardmask development and integration

Deposition of an amorphous carbon layer with high film density and high etch selectivity

CONFORMAL AMORPHOUS CARBON FOR SPACER AND SPACER PROTECTION APPLICATIONS

Amorphous carbon deposition method for improved stack defectivity

METHOD FOR DEPOSITING AN AMORPHOUS CARBON FILM WITH IMPROVED DENSITY AND STEP COVERAGE

Passivating glue layer to improve amorphous carbon to metal adhesion

METHODS TO IMPROVE THE IN-FILM DEFECTIVITY OF PECVD AMORPHOUS CARBON FILMS

Composite removable hardmask