Mountain View, California
United States
36
2017-08-31
The entities that hold a legal rights for patent applications filed by inventor PALAGASHVILI David:
David PALAGASHVILI from Mountain View, US has applied for patents for these inventions. The list has both pending applications and granted patents:
Plasma processing system workpiece carrier with thermally isolated heater plate blocks
#2 | 2017-01-12ETCH RATE AND CRITICAL DIMENSION UNIFORMITY BY SELECTION OF FOCUS RING MATERIAL
#3 | 2016-09-01Shielded lid heater assembly
#4 | 2015-12-31Chamber apparatus for chemical etching of dielectric materials
#5 | 2015-05-14Component temperature control by coolant flow control and heater duty cycle control
#6 | 2014-06-05DEPOSITION SHIELD FOR PLASMA ENHANCED SUBSTRATE PROCESSING
#7 | 2014-02-06TEMPERATURE ENHANCED ELECTROSTATIC CHUCKING IN PLASMA PROCESSING APPARATUS
#8 | 2013-12-26METHODS FOR HIGH TEMPERATURE ETCHING A HIGH-K GATE STRUCTURE
#9 | 2013-10-24Plasma reactor electrostatic chuck with cooled process ring and heated workpiece support surface
#10 | 2013-07-25Shielded lid heater assembly
#11 | 2012-04-26Low force substrate lift
#12 | 2012-03-01Temperature enhanced electrostatic chucking in plasma processing apparatus
#13 | 2012-03-01Component temperature control by coolant flow control and heater duty cycle control
#14 | 2012-02-02Apparatus for controlling the flow of a gas in a process chamber
#15 | 2011-07-07Chamber with uniform flow and plasma distribution
#16 | 2011-06-30Electrostatic chuck with reduced arcing
#17 | 2011-05-26SHOWERHEAD ASSEMBLY WITH IMPROVED IMPACT PROTECTION
#18 | 2011-03-24Method of processing a workpiece in a plasma reactor with independent wafer edge process gas injection
#19 | 2009-11-05PLASMA PROCESS EMPLOYING MULTIPLE ZONE GAS DISTRIBUTION FOR IMPROVED UNIFORMITY OF CRITICAL DIMENSION BIAS
#20 | 2009-11-05PLASMA REACTOR ELECTROSTATIC CHUCK HAVING A COAXIAL RF FEED AND MULTIZONE AC HEATER POWER TRANSMISSION THROUGH THE COAXIAL FEED
#21 | 2009-11-05Plasma reactor with center-fed multiple zone gas distribution for improved uniformity of critical dimension bias
#22 | 2009-09-24Shielded lid heater assembly
#23 | 2009-09-03ETCH RATE AND CRITICAL DIMENSION UNIFORMITY BY SELECTION OF FOCUS RING MATERIAL
#24 | 2009-09-03MULTIPLE PORT GAS INJECTION SYSTEM UTILIZED IN A SEMICONDUCTOR PROCESSING SYSTEM
#25 | 2009-03-05Method of processing a workpiece in a plasma reactor with independent wafer edge process gas injection
#26 | 2009-03-05Cathode liner with wafer edge gas injection in a plasma reactor chamber
#27 | 2009-01-01Methods for high temperature etching a high-K material gate structure
#28 | 2008-07-31TEMPERATURE-SWITCHED PROCESS FOR WAFER BACKSIDE POLYMER REMOVAL AND FRONT SIDE PHOTORESIST STRIP
#29 | 2008-07-31PROCESS FOR WAFER BACKSIDE POLYMER REMOVAL WITH A PLASMA STREAM
#30 | 2008-07-31PROCESS FOR WAFER BACKSIDE POLYMER REMOVAL AND WAFER FRONT SIDE SCAVENGER PLASMA
#31 | 2008-07-31PROCESS FOR WAFER BACKSIDE POLYMER REMOVAL WITH WAFER FRONT SIDE GAS PURGE
#32 | 2008-07-31Process for wafer backside polymer removal with a ring of plasma under the wafer
#33 | 2008-07-31REACTOR FOR WAFER BACKSIDE POLYMER REMOVAL USING AN ETCH PLASMA FEEDING A LOWER PROCESS ZONE AND A SCAVENGER PLASMA FEEDING AN UPPER PROCESS ZONE
#34 | 2008-07-31REACTOR FOR WAFER BACKSIDE POLYMER REMOVAL USING PLASMA PRODUCTS IN A LOWER PROCESS ZONE AND PURGE GASES IN AN UPPER PROCESS ZONE
#35 | 2008-07-31PROCESS FOR WAFER BACKSIDE POLYMER REMOVAL WITH A RING OF PLASMA UNDER THE WAFER
#36 | 2005-11-08Tandem etch chamber plasma processing system
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