Peter Wang

City:

Kaohsiung

Country:

Taiwan

Published Applications:

Last publication date:

2011-07-21

Top Assignees for applications by Peter Wang

The entities that hold a legal rights for patent applications filed by inventor Wang Peter:

Peter Wang from Kaohsiung, TW has applied for patents for these inventions. The list has both pending applications and granted patents:

Semiconductor packages including die and L-shaped lead and method of manufacture

Method of fabricating semiconductor package including die interposed between cup-shaped lead frame having mesas and valleys

Semiconductor package including die interposed between cup-shaped lead frame and lead frame having mesas and valleys

InventorID:

3549545 ⎘