Thomas S. Dory

Process that includes assembling together first and second substrates the have respective first and second carbon nanotube arrays with geometrically complementary patterns

Methods for manufacturing imprinted substrates

Process of making carbon nanotube array that includes impregnating the carbon nanotube array with metal

Array capacitor for decoupling multiple voltages

Electronic packages and components thereof formed by substrate-imprinting

HIGH PERFORMANCE INTEGRATED INDUCTOR

Packaging of integrated circuits with carbon nano-tube arrays to enhance heat dissipation through a thermal interface

Packaging of integrated circuits with carbon nano-tube arrays to enhance heat dissipation through a thermal interface

Conductive interconnects along the edge of a microelectronic device

Substrate-imprinting methods

Methods of forming a diamond micro-channel structure and resulting devices

Article having metal impregnated within carbon nanotube array

Low cost microelectronic circuit package

High performance integrated inductor

Packaging of integrated circuits with carbon nanotube arrays to enhance heat dissipation through a thermal interface

Deep via seed repair using electroless plating chemistry

Forming a combined copper diffusion barrier and seed layer

Self-aligned coaxial via capacitors

Compliant multi-composition interconnects

Deep via seed repair using electroless plating chemistry