Plano, Texas
United States
23
2010-05-13
The entities that hold a legal rights for patent applications filed by inventor Chen Linlin:
Linlin Chen from Plano, US has applied for patents for these inventions. The list has both pending applications and granted patents:
Apparatus and method for electrochemically depositing metal on a semiconductor workpiece
#2 | 2008-06-26CMP related scratch and defect improvement
#3 | 2007-04-03Plating-rinse-plating process for fabricating copper interconnects
#4 | 2006-11-14Method for applying metal features onto barrier layers using electrochemical deposition
#5 | 2006-10-03Apparatus and method for electrochemically depositing metal on a semiconductor workpiece
#6 | 2006-06-27Modified clean chemistry and megasonic nozzle for removing backside CMP slurries
#7 | 2006-05-23Contact assemblies, methods for making contact assemblies, and plating machines with contact assemblies for plating microelectronic workpieces
#8 | 2006-04-20Method for applying metal features onto metallized layers using electrochemical deposition and alloy treatment
#9 | 2006-04-13Method for applying metal features onto metallized layers using electrochemical deposition
#10 | 2006-04-13Method for applying metal features onto metallized layers using electrochemical deposition and electrolytic treatment
#11 | 2006-04-13Method for applying metal features onto metallized layers using electrochemical deposition using acid treatment
#12 | 2006-02-14Hydrogen-less CVD TiN process for FeRAM VIA0 barrier application
#13 | 2005-11-03Apparatus and method for electrochemically depositing metal on a semiconductor workpiece
#14 | 2005-10-20Electrochemical methods for the formation of protective features on metallized features
#15 | 2005-09-06Contact assemblies, methods for making contact assemblies, and plating machines with contact assemblies for plating microelectronic workpieces
#16 | 2005-08-23Apparatus and method for electrolytically depositing copper on a semiconductor workpiece
#17 | 2005-08-11Apparatus and method for electrolytically depositing copper on a semiconductor workpiece
#18 | 2005-07-19Apparatus and method for electrolytically depositing copper on a workpiece
#19 | 2005-06-28Contact assemblies, methods for making contact assemblies, and plating machines with contact assemblies for plating microelectronic workpieces
#20 | 2005-06-21Corrosion resistance for copper interconnects
#21 | 2005-05-31Automated chemical management system executing improved electrolyte analysis method
#22 | 2005-04-21Electroplating compositions and methods for electroplating
#23 | 2005-03-10Method of submicron metallization using electrochemical deposition of recesses including a first deposition at a first current density and a second deposition at an increased current density
3614078 ⎘