Thomas J. Obenhuber

City:

Country:

United States

Published Applications:

Last publication date:

2010-09-02

Top Assignees for applications by Thomas J. Obenhuber

The entities that hold a legal rights for patent applications filed by inventor Obenhuber Thomas J.:

Thomas J. Obenhuber from , US has applied for patents for these inventions. The list has both pending applications and granted patents:

Multi-surface IC packaging structures and methods for their manufacture

Low profile discrete electronic components and applications of same

Partitioned Integrated Circuit Package with Central Clock Driver

Multi-surface IC packaging structures and methods for their manufacture

Multi-surface contact IC packaging structures and assemblies

Multi-surface IC packaging structures and methods for their manufacture

InventorID:

3636775 ⎘