Cupertino, California
United States
28
2013-04-11
23
2012-12-18
These are the the leading inventors for applications assigned to INTERCONNECT PORTFOLIO LLC:
INTERCONNECT PORTFOLIO LLC based in Cupertino, US has been assigned the rights to these inventions. The list includes both Pending Applications and Patent Grants:
CONNECTOR CONSTRUCTIONS FOR ELECTRONIC APPLICATIONS
#2 | 2013-03-28TORSIONALLY-INDUCED CONTACT-FORCE CONDUCTORS FOR ELECTRICAL CONNECTOR SYSTEMS
#3 | 2012-09-06 ✅ Patent 8,333,617 granted on 2012-12-18Connector constructions for electronic applications
#4 | 2012-06-14 ✅ Patent 8,313,333 granted on 2012-11-20Connector having a housing with a conductor with a ramp section and a curved surface section
#5 | 2011-07-14 ✅ Patent 8,246,387 granted on 2012-08-21Connector constructions for electronic applications
#6 | 2011-07-14 ✅ Patent 8,079,848 granted on 2011-12-20Electrical connector with conductors with a ramp to induce torsion
#7 | 2011-04-07 ✅ Patent 8,053,898 granted on 2011-11-08Connection for off-chip electrostatic discharge protection
#8 | 2011-03-17 ✅ Patent 7,909,615 granted on 2011-03-22Torsionally-induced contact-force conductors for electrical connector systems
#9 | 2010-11-18Method and Apparatus for Vertical Stacking of Integrated Circuit Chips
#10 | 2010-11-11 ✅ Patent 8,199,450 granted on 2012-06-12ESD protection utilizing radiated thermal relief
#11 | 2010-10-14Interconnection of IC Chips by Flex Circuit Superstructure
#12 | 2010-09-02 ✅ Patent 7,919,355 granted on 2011-04-05Multi-surface IC packaging structures and methods for their manufacture
#13 | 2010-07-01 ✅ Patent 8,324,727 granted on 2012-12-04Low profile discrete electronic components and applications of same
#14 | 2010-06-17 ✅ Patent 8,047,855 granted on 2011-11-01High speed, direct path, stair-step, electronic connectors with improved signal integrity characteristics and methods for their manufacture
#15 | 2010-05-27Interconnect System without Through-Holes
#16 | 2010-05-06 ✅ Patent 7,837,477 granted on 2010-11-23Electrical interconnection devices incorporating Fedundant contact points for reducing capacitive stubs and improved signal integrity
#17 | 2010-04-20 ✅ Patent 7,701,323 granted on 2010-04-20Low profile discrete electronic components and applications of same
#18 | 2009-07-02 ✅ Patent 8,026,600 granted on 2011-09-27Controlled impedance structures for high density interconnections
#19 | 2009-04-09 ✅ Patent 7,651,336 granted on 2010-01-26High speed, direct path, stair-step, electronic connectors with improved signal integrity characteristics and methods for their manufacture
#20 | 2008-11-06 ✅ Patent 7,651,382 granted on 2010-01-26Electrical interconnection devices incorporating redundant contact points for reducing capacitive stubs and improved signal integrity
#21 | 2007-10-11 ✅ Patent 7,613,011 granted on 2009-11-03Signal-segregating connector system
#22 | 2007-08-02 ✅ Patent 7,404,746 granted on 2008-07-29Electrical interconnection devices incorporating redundant contact points for reducing capacitive stubs and improved signal integrity
#23 | 2006-07-20 ✅ Patent 7,737,545 granted on 2010-06-15Multi-surface IC packaging structures and methods for their manufacture
#24 | 2006-05-04 ✅ Patent 7,750,446 granted on 2010-07-06IC package structures having separate circuit interconnection structures and assemblies constructed thereof
#25 | 2006-02-16 ✅ Patent 7,845,986 granted on 2010-12-07Torsionally-induced contact-force conductors for electrical connector systems
#26 | 2005-09-01 ✅ Patent 7,652,381 granted on 2010-01-26Interconnect system without through-holes
#27 | 2005-06-23 ✅ Patent 7,388,279 granted on 2008-06-17Tapered dielectric and conductor structures and applications thereof
#28 | 2005-05-05 ✅ Patent 7,732,904 granted on 2010-06-08Multi-surface contact IC packaging structures and assemblies
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