Inventor profile of:

Ichiro MIHARA

City:

Tokyo

Country:

Japan

Published Applications:

18

Last publication date:

2025-09-25

Top Assignees for applications by Ichiro MIHARA

The entities that hold a legal rights for patent applications filed by inventor MIHARA Ichiro:

Recent patent applications by MIHARA Ichiro

Ichiro MIHARA from Tokyo, JP has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2025-09-25
US20250300026A1
Electricity

SEMICONDUCTOR DEVICE AND WIRING BOARD

#2 | 2010-09-30
US20100244188A1
Electricity

Semiconductor device and manufacturing method thereof

#3 | 2010-01-28
US20100019383A1
Electricity

Method of forming wiring on a plurality of semiconductor devices from a single metal plate, and a semiconductor construction assembly formed by the method

#4 | 2009-08-13
US20090200665A1
Electricity

Semiconductor device and method of manufacturing the same

#5 | 2008-08-28
US20080203526A1
Electricity

Semiconductor device equipped with thin-film circuit elements

#6 | 2008-02-21
US20080044944A1
Electricity

Semiconductor device including semiconductor element surrounded by an insulating member and wiring structures on upper and lower surfaces of the semiconductor element and insulating member, and manufacturing method thereof

#7 | 2008-01-10
US20080006943A1
Electricity

Semiconductor device including semiconductor element surrounded by an insulating member wiring structures on upper and lower surfaces of the semiconductor element and insulating member, and manufacturing method thereof

#8 | 2007-10-04
US20070228468A1
Electricity

Grounding structure of semiconductor device including a conductive paste

#9 | 2007-06-07
US20070126128A1
Electricity

Semiconductor device and method of manufacturing the same

#10 | 2007-05-03
US20070099409A1
Electricity

Semiconductor device and method of manufacturing the same

#11 | 2007-02-22
US20070042594A1
Electricity

Semiconductor device and method of manufacturing the same

#12 | 2006-11-02
US20060244136A1
Electricity

Semiconductor device including a base member and a semiconductor constructing body directly fixed to thermosetting resin of the base member

#13 | 2006-09-14
US20060202353A1
Electricity

Semiconductor device and method of manufacturing the same

#14 | 2005-07-28
US20050161823A1
Electricity

Semiconductor device

#15 | 2005-07-28
US20050161803A1
Electricity

Method of fabricating a semiconductor package utilizing a thermosetting resin base member

#16 | 2005-06-30
US20050140021A1
Electricity

Semiconductor device including semiconductor element surrounded by an insulating member and wiring structures on upper and lower surfaces of the semiconductor element and insulating member, and manufacturing method thereof

#17 | 2005-04-21
US20050084989A1
Electricity

Semiconductor device manufacturing method

#18 | 2005-03-10
US20050051886A1
Electricity

Semiconductor device and method of manufacturing the same

InventorID:

3658648 ⎘