Tokyo
Japan
18
2025-09-25
The entities that hold a legal rights for patent applications filed by inventor MIHARA Ichiro:
Ichiro MIHARA from Tokyo, JP has applied for patents for these inventions. The list has both pending applications and granted patents:
SEMICONDUCTOR DEVICE AND WIRING BOARD
#2 | 2010-09-30Semiconductor device and manufacturing method thereof
#3 | 2010-01-28Method of forming wiring on a plurality of semiconductor devices from a single metal plate, and a semiconductor construction assembly formed by the method
#4 | 2009-08-13Semiconductor device and method of manufacturing the same
#5 | 2008-08-28Semiconductor device equipped with thin-film circuit elements
#6 | 2008-02-21Semiconductor device including semiconductor element surrounded by an insulating member and wiring structures on upper and lower surfaces of the semiconductor element and insulating member, and manufacturing method thereof
#7 | 2008-01-10Semiconductor device including semiconductor element surrounded by an insulating member wiring structures on upper and lower surfaces of the semiconductor element and insulating member, and manufacturing method thereof
#8 | 2007-10-04Grounding structure of semiconductor device including a conductive paste
#9 | 2007-06-07Semiconductor device and method of manufacturing the same
#10 | 2007-05-03Semiconductor device and method of manufacturing the same
#11 | 2007-02-22Semiconductor device and method of manufacturing the same
#12 | 2006-11-02Semiconductor device including a base member and a semiconductor constructing body directly fixed to thermosetting resin of the base member
#13 | 2006-09-14Semiconductor device and method of manufacturing the same
#14 | 2005-07-28Semiconductor device
#15 | 2005-07-28Method of fabricating a semiconductor package utilizing a thermosetting resin base member
#16 | 2005-06-30Semiconductor device including semiconductor element surrounded by an insulating member and wiring structures on upper and lower surfaces of the semiconductor element and insulating member, and manufacturing method thereof
#17 | 2005-04-21Semiconductor device manufacturing method
#18 | 2005-03-10Semiconductor device and method of manufacturing the same
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