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Assignee profile:

CMK CORPORATION

City:

Tokyo

Country:

Japan

Published Applications:

Last publication date:

2011-04-21

Patent Grants:

Last grant date:

2011-10-11

Top Inventors for applications by CMK CORPORATION

These are the the leading inventors for applications assigned to CMK CORPORATION:

Hiroyasu Jobetto 9 Hachioji, Japan
Hiroyasu JOBETTO 5 Tokyo, Japan
Yutaka Yoshino 4 Isesaki, Japan
Yutaka YOSHINO 3 Isesaki-shi, Japan

Toshihiro Kido 2 Tokyo, Japan
Jun Yoshizawa 2 Isesaki-shi, Japan
Eiji Hirata 2 Isesaki, Japan
Jun Yoshizawa 2 Isesaki, Japan

Takahiro Shirai 2 Isesaki, Japan
Nobuyuki Kageyama 2 Saitama-shi, Japan
Daita Kohno 2 Itako-shi, Japan
Hiroyasu JOBETTO 2 Hachioji-shi, Japan

Daita Kohno 2 Itako, Japan
Nobuyuki Kageyama 2 Saitama, Japan
Takeshi Wakabayashi 2 Sayama, Japan
Ichiro Mihara 2 Tachikawa, Japan

Toshihiro Kido 2 Ome, Japan
Makoto Araki 2 Shinjuku-ku, Japan
Ichiro MIHARA 2 Tokyo, Japan
Minoru Enomoto 2 Shinjuku-ku, Japan

Naoki Toda 2 Shinjuku-ku, Japan
Takeshi Wakabayashi 2 Sayama-shi, Japan
Eiji Hirata 2 Isesaki-shi, Japan
Mineo Kawamoto 2 Kitakanbara-gun, Japan

Masakatsu Goto 2 Shinjuku-ku, Japan
Shinji Kadono 2 Isesaki, Japan
Hiroshi Tohkairin 1 Gunma, Japan
Kenji Sakakibara 1 Aichi, Japan

Takahiro Shirai 1 Isesaki-shi, Japan
Hideki Kabune 1 Chiryuu, Japan
Kenji Sakakibara 1 Kariya, Japan
Hiriyasu Jobetto 1 Hachioji-shi, Japan

Osamu Okada 1 Hamura-shi, Japan
Osamu Okada 1 Hamura, Japan
Hiroshi Tohkairin 1 Isesaki, Japan
Shinji Kadono 1 Isesaki-shi, Japan

Hideki Kabune 1 Aichi, Japan
Yutaka YOSHINO 1 , United States

Recent patent applications by CMK CORPORATION

CMK CORPORATION based in Tokyo, JP has been assigned the rights to these inventions. The list includes both Pending Applications and Patent Grants:

#1 | 2011-04-21 ✅ Patent 8,035,979 granted on 2011-10-11

US20110090657A1

Electricity

Printed wiring board with built-in semiconductor element, and process for producing the same

#2 | 2010-05-04 ✅ Patent 7,709,942 granted on 2010-05-04

US10860478

Semiconductor package, including connected upper and lower interconnections

#3 | 2009-05-21 ✅ Patent 7,894,200 granted on 2011-02-22

US20090129037A1

Electricity

Printed wiring board with built-in semiconductor element, and process for producing the same

#4 | 2008-07-10 ✅ Patent 7,615,411 granted on 2009-11-10

US20080166836A1

Electricity

Semiconductor package including connected upper and lower interconnections, and manufacturing method thereof

#5 | 2008-01-17 ✅ Patent 7,867,828 granted on 2011-01-11

US20080014681A1

Electricity

Method of fabricating a semiconductor device including forming an insulating layer with a hard sheet buried therein

#6 | 2007-11-15 ✅ Patent 7,608,480 granted on 2009-10-27

US20070264754A1

Electricity

Method of fabricating a semiconductor device incorporating a semiconductor constructing body and an interconnecting layer which is connected to a ground layer via a vertical conducting portion

#7 | 2007-10-04 ✅ Patent 7,910,405 granted on 2011-03-22

US20070232061A1

Electricity

Semiconductor device having adhesion increasing film to prevent peeling

#8 | 2007-05-03 ✅ Patent 7,445,964 granted on 2008-11-04

US20070099409A1

Electricity

Semiconductor device and method of manufacturing the same

#9 | 2006-06-29 ✅ Patent 7,243,425 granted on 2007-07-17

US20060137906A1

Electricity

Printed wiring board and method of manufacturing the same

#10 | 2006-06-29 ✅ Patent 7,363,706 granted on 2008-04-29

US20060137904A1

Electricity

Method of manufacturing a multilayer printed wiring board

#11 | 2005-10-06 ✅ Patent 7,279,750 granted on 2007-10-09

US20050218451A1

Electricity

Semiconductor device incorporating a semiconductor constructing body and an interconnecting layer which is connected to a ground layer via a vertical conducting portion

#12 | 2005-07-07 ✅ Patent 7,087,845 granted on 2006-08-08

US20050145414A1

Electricity

Metal core multilayer printed wiring board

#13 | 2005-06-30 ✅ Patent 7,489,032 granted on 2009-02-10

US20050140007A1

Electricity

Semiconductor device including a hard sheet to reduce warping of a base plate and method of fabricating the same

#14 | 2005-03-10 ✅ Patent 7,183,639 granted on 2007-02-27

US20050051886A1

Electricity

Semiconductor device and method of manufacturing the same

AssigneeID:

259296 ⎘