Regensburg
Germany
23
2020-10-08
The entities that hold a legal rights for patent applications filed by inventor Hoeckele Uwe:
Uwe Hoeckele from Regensburg, DE has applied for patents for these inventions. The list has both pending applications and granted patents:
Method of manufacturing an imager and imager device
#2 | 2020-01-02Method of manufacturing an imager and imager device
#3 | 2019-04-18Method for sealing an access opening to a cavity and MEMS component comprising a sealing element
#4 | 2017-10-19Method of manufacturing an imager and imager device
#5 | 2016-08-25Bonded system and a method for adhesively bonding a hygroscopic material
#6 | 2016-03-24Method for Producing a Semiconductor Device
#7 | 2015-08-20Passivation layer and method of making a passivation layer
#8 | 2015-07-09Conductive Lines and Pads and Method of Manufacturing Thereof
#9 | 2015-03-26Chip Comprising an Integrated Circuit, Fabrication Method and Method for Locally Rendering a Carbonic Layer Conductive
#10 | 2014-09-25Method of manufacturing an imager and imager device
#11 | 2014-05-01Passivation Layer and Method of Making a Passivation Layer
#12 | 2014-03-27Method for manufacturing a device on a substrate
#13 | 2014-03-13Chip comprising an integrated circuit, fabrication method and method for locally rendering a carbonic layer conductive
#14 | 2014-02-20Conductive lines and pads and method of manufacturing thereof
#15 | 2013-10-10Through substrate via semiconductor components and methods of formation thereof
#16 | 2013-10-03Semiconductor packages and methods of formation thereof
#17 | 2013-01-17Chip comprising an integrated circuit, fabrication method and method for locally rendering a carbonic layer conductive
#18 | 2012-11-15Method for producing a semiconductor device
#19 | 2012-01-19Conductive lines and pads and method of manufacturing thereof
#20 | 2010-10-07Method for manufacturing a device on a substrate
#21 | 2010-09-16Through substrate via semiconductor components
#22 | 2009-12-10Through substrate via semiconductor components
#23 | 2008-07-31Integrated circuit having a semiconductor arrangement
36905 ⎘