Ying Rui

City:

Country:

United States

Published Applications:

Last publication date:

2010-02-18

Top Assignees for applications by Ying Rui

The entities that hold a legal rights for patent applications filed by inventor Rui Ying:

Ying Rui from , US has applied for patents for these inventions. The list has both pending applications and granted patents:

High density plasma gapfill deposition-etch-deposition process etchant

Method and apparatus for removing polymer from the wafer backside and edge

InventorID:

3757298 ⎘