Inventor profile of:

Daisuke TAKAGI

City:

Tokyo

Country:

Japan

Published Applications:

17

Last publication date:

2025-12-04

Top Assignees for applications by Daisuke TAKAGI

The entities that hold a legal rights for patent applications filed by inventor TAKAGI Daisuke:

Recent patent applications by TAKAGI Daisuke

Daisuke TAKAGI from Tokyo, JP has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2025-12-04
US20250369205A1
Fixed constructions

WORK MACHINE AND CONTROL METHOD FOR WORK MACHINE

#2 | 2025-09-25
US20250297458A1
Fixed constructions

CONTROL DEVICE, CONTROL METHOD, AND WORK MACHINE

#3 | 2025-09-25
US20250297455A1
Fixed constructions

CONTROL DEVICE, CONTROL METHOD, AND WORKING MACHINE

#4 | 2010-04-29
US20100105154A1
Electricity

METHOD AND APPARATUS FOR PROCESSING SUBSTRATE

#5 | 2010-03-25
US20100075498A1
Electricity

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME, AND PROCESSING LIQUID

#6 | 2009-01-01
US20090000549A1
Electricity

Substrate processing method and apparatus

#7 | 2008-06-12
US20080138508A1
Chemistry; metallurgy

Substrate Processing Method and Substrate Processing Apparatus

#8 | 2008-03-20
US20080067679A1
Electricity

Semiconductor Device and Method for Manufacturing the Same, and Processing Liquid

#9 | 2008-01-03
US20080000776A1
Electricity

Method and apparatus for processing substrate

#10 | 2007-10-04
US20070228569A1
Electricity

Interconnects forming method and interconnects forming apparatus

#11 | 2007-09-27
US20070224811A1
Electricity

Substrate processing method and substrate processing apparatus

#12 | 2006-03-16
US20060057839A1
Electricity

Method and apparatus for forming metal film

#13 | 2005-11-03
US20050245080A1
Electricity

Method for processing substrate

#14 | 2005-03-24
US20050064702A1
Electricity

Interconnects forming method and interconnects forming apparatus

#15 | 2005-02-03
US20050022909A1
Chemistry; metallurgy

Substrate processing method and substrate processing apparatus

#16 | 2005-01-13
US20050009340A1
Electricity

Method and apparatus for forming capping film

#17 | 2005-01-13
US20050009213A1
Electricity

Substrate processing method

InventorID:

3769475 ⎘