Tokyo
Japan
17
2022-07-21
The entities that hold a legal rights for patent applications filed by inventor Owatari Akira:
Akira Owatari from Tokyo, JP has applied for patents for these inventions. The list has both pending applications and granted patents:
Plating method, insoluble anode for plating, and plating apparatus
#2 | 2010-04-29METHOD AND APPARATUS FOR PROCESSING SUBSTRATE
#3 | 2010-03-25SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME, AND PROCESSING LIQUID
#4 | 2008-07-24Apparatus and method for forming magnetic film
#5 | 2008-06-12Substrate Processing Method and Substrate Processing Apparatus
#6 | 2008-03-20Semiconductor Device and Method for Manufacturing the Same, and Processing Liquid
#7 | 2008-01-03Method and apparatus for processing substrate
#8 | 2007-09-27Substrate processing method and substrate processing apparatus
#9 | 2007-04-26Electroless plating apparatus and electroless plating method
#10 | 2006-11-02Substrate processing apparatus and substrate processing method
#11 | 2006-11-02Substrate processing apparatus and substrate processing method
#12 | 2006-10-26Substrate processing apparatus and substrate processing method
#13 | 2006-03-16Method and apparatus for forming metal film
#14 | 2005-11-03Method for processing substrate
#15 | 2005-09-22Wet processing method and processing apparatus of substrate
#16 | 2005-04-07Substrate processing apparatus and substrate processing method
#17 | 2005-02-03Substrate processing method and substrate processing apparatus
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